Patents by Inventor Lee Lee CHAI

Lee Lee CHAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure-sensitive adhesive tape
    Patent number: 11053415
    Abstract: A pressure-sensitive adhesive tape comprises a backing layer having a first and a second surface; and a first pressure-sensitive adhesive layer affixed to the first surface; wherein the first pressure-sensitive adhesive layer has an adhesive strength of 2.0 N/10 mm to 9.0 N/10 mm in absence of a solvent and the pressure-sensitive adhesive tape has a tensile strength in longitudinal direction of 45 N/15 mm to 80 N/15 mm.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 6, 2021
    Assignees: NITTO DENKO MATERIALS (MALAYSIA) SDN. BHD., NITTO DENKO CORPORATION
    Inventor: Lee Lee Chai
  • PRESSURE-SENSITIVE ADHESIVE TAPE
    Publication number: 20190225841
    Abstract: The present invention relates to a pressure-sensitive adhesive tape comprising a backing layer having a first and a second surface; and a first pressure-sensitive adhesive layer affixed to the first surface; wherein the first pressure-sensitive adhesive layer has an adhesive strength of 2.0 N/10 mm to 9.0 N/10 mm in absence of a solvent and the pressure-sensitive adhesive tape has a tensile strength in longitudinal direction of 45 N/15 mm to 80 N/15 mm.
    Type: Application
    Filed: January 23, 2019
    Publication date: July 25, 2019
    Inventor: Lee Lee CHAI