Patents by Inventor Lee Levine

Lee Levine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for bonding wires
    Publication number: 20060186179
    Abstract: A wire bonder and a method of bonding a bonding wire to a bonding pad of a bonding location using the wire bonder are provided. The method includes forming a bonding ball at an end of the bonding wire, pre-deforming at least a portion of the bonding ball and bonding the pre-deformed ball to the bonding pad. The wire bonder includes a source of heat disposed adjacent a bonding tool to melt a portion of the bonding wire to produce the bonding ball at an end thereof, and a pre-deforming unit including a deforming surface to pre-deform at least a portion of the bonding ball.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Inventors: Lee Levine, Matthew Osborne, Stephen Babinetz, Jon Brunner