Abstract: A method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. The method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.

Abstract: A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

Abstract: Herein is database query acceleration from dynamic discovery of whether contents of a persistent column can be stored in an accelerated representation in storage-side memory. In an embodiment, based on data type discovery, a storage server detects that column values in a persistent column have a particular data type. Based on storage-side metadata including a frequency of access of the persistent column as an offload input column for offload computation requests on a certain range of memory addresses, the storage server autonomously decides to generate and store, in storage-side memory in the storage server, an accelerated representation of the persistent column that is based on the particular data type. The storage server receives a request to perform an offload computation for the offload input column. Based on the accelerated representation of the persistent column, execution of the offload computation is accelerated.

Abstract: Methods and systems for the fabrication of composite materials are generally described. Certain inventive methods and systems can be used to fabricate composite materials with few or no defects. According to certain embodiments, composite materials are fabricated without the use of an autoclave. In some embodiments, composite materials are fabricated in low pressure environments.

Abstract: A multiple-tier operation evaluates a query across storage tiers in columnar format. A database server receives from a client a query for reading values from a set of columns of a database table. The multiple-tier operation comprises accessing a first subset of rows for the set of columns in columnar format in a first tier to generate a first set of results and accessing a second subset of rows for the set of columns in columnar format in a second tier to generate a second subset of results. The multiple-tier operation further comprises aggregating the first set of results and the second set of results to form a query result set and returning the query result set to the client.

Abstract: A system and method for filtering a fluid includes a manifold and a filter releasably connected to the manifold that includes a memory storage device. A filter valve in fluid communication with the manifold has an open position that allows the fluid to flow through the filter and a shut position that prevents the fluid from flowing through the filter valve. A sensor in fluid communication with the manifold generates a fluid parameter signal reflective of a characteristic of the fluid flowing through the manifold. A controller receives the fluid parameter signal and positions the filter valve to the shut position when the fluid parameter signal meets a predetermined fluid condition.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: Techniques for implementing and/or operating a test head that includes an end cap assembly; a bore plug assembly including a plug fastener mechanism; an inflation fluid port and an annulus fluid port that open through the end cap assembly; and an internal inflation fluid conduit that connects the inflation fluid port to the plug fastener mechanism. The end cap assembly includes a cap end plate that covers an open end of a pipe segment, a cap sleeve to be disposed around the pipe segment, and a cap fastener mechanism that runs along an inner surface of the cap sleeve and that expands inward such that the cap fastener mechanism engages an outer surface of the pipe segment. The plug fastener mechanism is to be disposed within a pipe bore of the pipe segment and expands outward such that the plug fastener mechanism engages an inner surface of the pipe segment.

Abstract: A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

Abstract: Techniques for implementing and/or operating a system that includes a pipe fitting to be secured to a pipe segment, in which the pipe fitting includes a grab ring having a grab notch and a fitting jacket to be conformally deformed around tubing of the pipe segment to facilitate securing the pipe fitting to the pipe segment. The system includes a swage machine, which includes a grab plate having a grab tab that matingly interlocks with the grab notch to facilitate securing the pipe fitting to the swage machine, a die plate including a die that opens away from the grab plate, and a swaging actuator secured to the die plate. The swage machine operates the swaging actuator to move the die plate over the fitting jacket in an outwardly axial direction away from the grab plate to facilitate conformally deforming the fitting jacket around the tubing of the pipe segment.

Abstract: A gas turbine engine assembly includes first and second annular members having different first and second thermal expansion coefficients connected together with dual arm V brackets. Brackets include first and second arms angularly spaced apart from a bracket centerline and extending axially away from bracket bases attached to a first one of the first and second annular members. Arms are attached to a second one of the first and second annular members. A turbine frame includes struts extending between outer and inner rings. An annular mixer and centerbody substantially made from a ceramic matrix composite materials is connected to and supported by the outer and inner rings with first and second sets respectively of the dual arm V brackets. Bracket bases of the first and second sets are attached to the outer and inner rings respectively. Arms of the first and second sets are attached to mixer and centerbody respectively.

Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

Abstract: An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.

Abstract: The invention relates to a safety link for use in lifting, winching, towing or securing apparatus or similar. The safety link including, a first connection point, a second connection point, and an indicator means positioned substantially between and associated with the first connection point and the second connection point. If an overload force is applied, the forces between the first connection point and the second connection point cause a change in the indicator means, whereby the change indicates the overload to the user so safety checks may be conducted. The invention also relates to a method of use.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

Abstract: A method for obtaining three-dimension measurements for an object utilizing a population of radio-frequency identification (RFID) chips in a medium includes placing the object into a container with the population of RFID chips in the medium. The method also includes capturing a plurality of coordinates for the population of RFID chips in the medium, where a set of coordinates from the plurality of coordinates correspond to each RFID chip from the population of RFID chips. The method includes plotting the plurality of coordinates for the population of RFID chips in the medium, wherein a plot of the plurality of coordinates provides a three-dimensional image of the object.

Abstract: Techniques for implementing and/or operating a system that includes a pipe fitting to be secured to a pipe segment, in which the pipe fitting includes a grab ring having a grab notch and a fitting jacket to be conformally deformed around tubing of the pipe segment to facilitate securing the pipe fitting to the pipe segment. The system includes a swage machine, which includes a grab plate having a grab tab that matingly interlocks with the grab notch to facilitate securing the pipe fitting to the swage machine, a die plate including a die that opens away from the grab plate, and a swaging actuator secured to the die plate. The swage machine operates the swaging actuator to move the die plate over the fitting jacket in an outwardly axial direction away from the grab plate to facilitate conformally deforming the fitting jacket around the tubing of the pipe segment.

Abstract: Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

Abstract: A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.