Patents by Inventor Lee P. Springer

Lee P. Springer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanically enhanced, high impact strength triazine resins, and method of preparing same
    Patent number: 5250347
    Abstract: Disclosed are filled poly(triazine) resin dielectrics and microelectronic circuit packages incorporating them. In the filled poly (triazine) dielectric composites, dispersed thermoplastic polymeric fillers are used to reduce the brittleness and increase the ductility of the triazine polymer, while preserving the low dielectric constant of the triazine host matrix-based composite.
    Type: Grant
    Filed: March 10, 1992
    Date of Patent: October 5, 1993
    Assignee: International Business Machines Corporation
    Inventors: Ashit A. Mehta, Tyan M. Niu, Lee P. Springer, William J. Summa, Lee P. Wilding
  • Adhesives on polymide films and methods of preparing them
    Patent number: 5206074
    Abstract: Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.
    Type: Grant
    Filed: February 20, 1991
    Date of Patent: April 27, 1993
    Assignee: International Business Machines Corporation
    Inventors: Charles R. Davis, Ashit A. Mehta, Konstantinos Papathomas, Lee P. Springer, William J. Summa, David W. Wang