Patents by Inventor Lee Phillips Gilbert

Lee Phillips Gilbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240051273
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer formed form a composition including polypropylene copolymer and/or a high density polyethylene (HDPE) resin; and a second polymeric layer formed from a composition including a high density polyethylene (HDPE) resin, a linear low density polyethylene (LLDPE) resin, a low density polyethylene (LDPE), and/or LDPE/HDPE copolymer with a coextruded ethyl vinyl alcohol (EVOH) and compatibilizer. Recyclable packaging containers formed of the packaging laminates are also disclosed.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 15, 2024
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Patent number: 11766851
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: September 26, 2023
    Assignee: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20230150249
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Application
    Filed: January 23, 2023
    Publication date: May 18, 2023
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20220234338
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Application
    Filed: April 11, 2022
    Publication date: July 28, 2022
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20220153001
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer; and a second polymeric layer comprising a high density polyethylene (HDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer.
    Type: Application
    Filed: January 31, 2022
    Publication date: May 19, 2022
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Patent number: 11298922
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 12, 2022
    Assignee: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Patent number: 11235561
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer; and a second polymeric layer comprising a high density polyethylene (HDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: February 1, 2022
    Assignee: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20190134956
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer; and a second polymeric layer comprising a high density polyethylene (HDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer.
    Type: Application
    Filed: February 24, 2017
    Publication date: May 9, 2019
    Inventor: Lee Phillips Gilbert
  • Publication number: 20180354241
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene, (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Application
    Filed: August 21, 2018
    Publication date: December 13, 2018
    Applicant: BMSI, Inc
    Inventor: Lee Phillips Gilbert
  • Publication number: 20170239920
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer; and a second polymeric layer comprising a high density polyethylene (HDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer.
    Type: Application
    Filed: February 24, 2017
    Publication date: August 24, 2017
    Inventor: Lee Phillips Gilbert