Abstract: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

Abstract: A child seat and a method for monitoring installation of the child seat are provided. The child seat includes a child seat frame configured to receive a child occupant. The child seat frame is configured to receive a seat belt webbing for securing the child seat frame to a vehicle seat. The child seat further includes a first bladder configured to contact the seat belt webbing. The first bladder has a fluid therein. The child seat further includes a first pressure sensor fluidly communicating with the fluid in the first bladder. The first pressure sensor is configured to output a first signal indicative of an amount of pressure in the first bladder. The child seat further includes a controller coupled to the child seat frame configured to receive the first signal and to compute a first tension value based on the first signal.

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract: A child seat and a method for monitoring installation of the child seat are provided. The child seat includes a child seat frame configured to receive a child occupant. The child seat frame is configured to receive a seat belt webbing for securing the child seat frame to a vehicle seat. The child seat further includes a first bladder configured to contact the seat belt webbing. The first bladder has a fluid therein. The child seat further includes a first pressure sensor fluidly communicating with the fluid in the first bladder. The first pressure sensor is configured to output a first signal indicative of an amount of pressure in the first bladder. The child seat further includes a controller coupled to the child seat frame configured to receive the first signal and to compute a first tension value based on the first signal.

Abstract: An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make contact with connectors on the base. The base is formed of a polymeric material and contains protrusions for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component and the support.

Abstract: An electronic assembly includes a printed circuit board and an electrical component arranged within a housing. The component is mounted in a lower region of the housing, and the printed circuit board is supported over the component. The housing is formed of a electrically insulating material and includes embedded conductors connecting the component to the printed circuit board. Potting material is disposed on the printed circuit board within the housing. A fill hole may be provided in the board over the component to allow the potting material to flow onto the electrical component for mechanical stabilization.

Abstract: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

Abstract: A capacitive sensor apparatus is disposed between the bottom cushion and frame of a seat. The sensor apparatus includes first and second mutually parallel rigid force translation plates biased apart by a set of springs, first and second conductor plates centrally affixed to inboard faces of the first and second force translation plates, and a control circuit responsive to the gap capacitance between the first and second conductor plates. The force translation plates are joined in a manner to maintain the conductor plates parallel to each other while permitting movement of either force translation plate relative to the other in a mutually perpendicular direction.

Abstract: A capacitive sensor apparatus is disposed between the bottom cushion and frame of a seat. The sensor apparatus includes first and second mutually parallel rigid force translation plates biased apart by a set of springs, first and second conductor plates centrally affixed to inboard faces of the first and second force translation plates, and a control circuit responsive to the gap capacitance between the first and second conductor plates. The force translation plates are joined in a manner to maintain the conductor plates parallel to each other while permitting movement of either force translation plate relative to the other in a mutually perpendicular direction.

Abstract: A sealed electronic module includes a housing having an open end and a circuit board that is both peripherally and centrally supported within the housing, where potting material applied to the exposed face of the circuit board peripherally and centrally affixes the circuit board to the housing and also environmentally seals the module. The central support for the circuit board is provided by a support post that is integral with the housing. A reduced size tip of the support post extends through an opening formed in a central area of the circuit board, and potting material applied to the exposed face of the circuit board for sealing the module also flows into the circuit board opening around the tip of the support post. The cured potting material structurally bonds the periphery of the circuit board to the housing walls and the central area of the circuit board to the housing support post.

Abstract: A process for mounting a surface-mount component(12), such as a stick-leaded device, to a circuit board (10) having a pair of plated through-holes and at least one additional through-hole (20), each of which extends through the circuit board (10). The leads (16) of the component (12) are then inserted into the plated through-holes so as to position the component (12) on a first side of the circuit board (10), after which a material (14) is applied to the second (opposite) side of the circuit board (10) so that the material (14) flows through the second through-hole (20), contacts the component (12), and bonds the component (12) to the first side of the circuit board (10). For this purpose, the material (14) preferably contacts the entire surface (18) of the component (12) facing a near surface region of the circuit board (10) and bonds the component surface (18) to the surface region.

Abstract: A die cast housing having an open side receives a circuit which seats on a housing ledge near the open side. An accelerometer and other components carried by the board are enclosed by the housing and board. The outer side of the circuit board is covered with an adhesive sealant compound which secures and seals the circuit board to the housing without fasteners for efficient structural transmissibility, and also structurally dampens the circuit board. A sheet metal cover over the open side inhibits electromagnetic interference. Lateral ports on the housing are aligned with connectors on the circuit board and permit coupling to the circuit board by mating connectors which seal the ports. The connectors have an interference fit with webs on the housing to permit thrust testing before the adhesive sealant is cured.

Abstract: A U-shaped ground clip and I/O pins are attached to a connector or header of a printed circuit board. The clip has leads which extend into the circuit board for connection to a ground plane and a spring portion which is biased against a metal case to afford a ground connection. The header securely positions the clip during soldering to assure a proper final configuration and to add stiffness to the clip to insure adequate force against the case.

Abstract: A trailer hitch cover includes a removable hollow housing and a latch for securing the enclosure to the hitch so that it will remain in place while it is installed on the hitch. The hollow housing has an enclosed body and a tubular neck connected to and protruding from one wall of the enclosed body and being open at its outer end. The neck has a cross sectional size substantially smaller than that of the body. The enclosed body is formed by a pair of identical halves hinged together. Mating parts of the latch are mounted to identical halves of the tubular neck. The halves of the hitch cover are thus releasably secured together in a clam-shell fashion over the hitch so as to be mounted to a portion of the hitch at only the hollow neck of the housing.

Abstract: An automated computer controlled process optical fiber splicing system 11 which yields consistent, high strength, low loss, high quality splices. The system of the invention includes a positioning system 17, 21, 29, and 31 for moving at least two optical fiber ends 15 and 19 into relative alignment at a junction 23. A high intensity beam of energy 37 is directed at the junction 23 of the fibers to achieve the high temperatures required for fusing the ends thereof. The focus of the beam 37 is adjusted to control the temperature profile of the energy applied to the junction 23.