Patents by Inventor Lee-Sheng Yen
Lee-Sheng Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170301842Abstract: A light emitting package structure is provided, which includes: a lead frame having at least two leads with a gap formed therebetween; a light emitting element crossing the gap and bonded to the at least two leads; and a plurality of conductive elements electrically connected with the light emitting element and the leads. Since the weight and stress of the light emitting element are borne by the leads, the stress can be evenly distributed to thereby prevent tilted disposing of the light emitting package structure on a circuit board or a tombstoning effect and cause the light emitting package structure to obtain a preferred light pattern.Type: ApplicationFiled: July 1, 2016Publication date: October 19, 2017Inventor: Lee-Sheng YEN
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Publication number: 20170271267Abstract: A semiconductor packaging structure includes a solder resist layer with a circuit layer embedded therein, a semiconductor element disposed on the solder resist layer and electrically connected with the circuit layer, and a dielectric encapsulating the semiconductor element. As a result, the thickness of the overall structure can be greatly reduced.Type: ApplicationFiled: November 21, 2016Publication date: September 21, 2017Inventor: Lee-Sheng Yen
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Patent number: 9084341Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.Type: GrantFiled: February 26, 2014Date of Patent: July 14, 2015Assignee: Advance Materials CorporationInventors: Lee-Sheng Yen, Doau-Tzu Wang
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Publication number: 20150171296Abstract: A light emitting package is provided, including a plurality of conductive traces, an insulative portion combined with the conductive traces to form a packaging substrate, a receiving body formed on the packaging substrate and having an opening for the first surfaces of the conductive traces to be exposed therefrom, a light emitting member disposed on the substrate via the opening and electrically connected with the conductive traces, and an encapsulant formed in the opening to encapsulate the light emitting member. The conductive traces combined with the insulative portion are used to carry the light emitting member, allowing the light emitting package to thus meet the low-profile requirement and the heat transmission efficiency to be greatly enhanced.Type: ApplicationFiled: April 18, 2014Publication date: June 18, 2015Inventor: Lee-Sheng Yen
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Publication number: 20150147535Abstract: A laminate is disclosed, which includes: a core layer having an adhesive property; an isolation layer directly adhered to the core layer; and a metal layer attached onto the isolation layer such that the isolation layer is sandwiched between the metal layer and the core layer. Therein, the metal layer is directly adhered to the core layer through an outer peripheral portion thereof and not attached to the isolation layer. As such, during fabrication of a packaging substrate, the metal layer and the isolation layer can be automatically separated from each other by removing the bonding portions of the metal layer and the core layer.Type: ApplicationFiled: November 26, 2013Publication date: May 28, 2015Inventor: Lee-Sheng Yen
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Patent number: 8987060Abstract: A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.Type: GrantFiled: April 16, 2013Date of Patent: March 24, 2015Assignee: Advance Materials CorporationInventor: Lee-Sheng Yen
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Patent number: 8836108Abstract: A circuit board structure, a packaging structure and a method for making the same are disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.Type: GrantFiled: July 14, 2010Date of Patent: September 16, 2014Assignee: Advance Materials CorporationInventor: Lee-Sheng Yen
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Publication number: 20140174644Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.Type: ApplicationFiled: February 26, 2014Publication date: June 26, 2014Applicant: Advance Materials CorporationInventors: Lee-Sheng Yen, Doau-Tzu Wang
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Patent number: 8748234Abstract: A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.Type: GrantFiled: June 25, 2012Date of Patent: June 10, 2014Assignee: Advance Materials CorporationInventor: Lee-Sheng Yen
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Patent number: 8742567Abstract: A circuit board structure at least includes a patterned solder mask, a first conductive pattern, a second conductive pattern adjacent to the first conductive pattern and in direct contact with the patterned solder mask and a passivation respectively covering the first conductive pattern and the second conductive pattern.Type: GrantFiled: June 25, 2012Date of Patent: June 3, 2014Assignee: Advance Materials CorporationInventor: Lee-Sheng Yen
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Patent number: 8698008Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.Type: GrantFiled: December 12, 2011Date of Patent: April 15, 2014Assignee: Advance Materials CorporationInventors: Lee-Sheng Yen, Doau-Tzu Wang
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Patent number: 8628636Abstract: A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.Type: GrantFiled: January 13, 2012Date of Patent: January 14, 2014Assignee: Advance Materials CorporationInventors: Lee-Sheng Yen, Doau-Tzu Wang
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Publication number: 20130180651Abstract: A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.Type: ApplicationFiled: January 13, 2012Publication date: July 18, 2013Applicant: ADVANCE MATERIALS CORPORATIONInventors: Lee-Sheng Yen, Doau-Tzu Wang
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Publication number: 20130146336Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.Type: ApplicationFiled: December 12, 2011Publication date: June 13, 2013Applicant: ADVANCE MATERIALS CORPORATIONInventors: Lee-Sheng Yen, Doau-Tzu Wang
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Publication number: 20120260502Abstract: A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.Type: ApplicationFiled: June 25, 2012Publication date: October 18, 2012Inventor: Lee-Sheng Yen
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Publication number: 20120261176Abstract: A circuit board structure at least includes a patterned solder mask, a first conductive pattern, a second conductive pattern adjacent to the first conductive pattern and in direct contact with the patterned solder mask and a passivation respectively covering the first conductive pattern and the second conductive pattern.Type: ApplicationFiled: June 25, 2012Publication date: October 18, 2012Inventor: Lee-Sheng Yen
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Patent number: 8102063Abstract: A pad structure includes a copper circuit pattern on a substrate, at least a gold layer stacked on the copper circuit pattern, and a nano-structured coating film stacked on the gold layer.Type: GrantFiled: January 11, 2010Date of Patent: January 24, 2012Assignee: Advance Materials CorporationInventor: Lee-Sheng Yen
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Publication number: 20110260340Abstract: A method for making a circuit board structure is disclosed. First, a substrate is provided. The substrate includes a carrier, a copper film and a release film disposed between them. Next, the copper film is patterned to form a connecting pattern and a die pad. Later, a passivation layer is formed to cover the connecting pattern and the die pad.Type: ApplicationFiled: June 14, 2010Publication date: October 27, 2011Inventor: Lee-Sheng Yen
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Publication number: 20110260308Abstract: A circuit board structure, a packaging structure and a method for making the same are disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.Type: ApplicationFiled: July 14, 2010Publication date: October 27, 2011Inventor: Lee-Sheng Yen
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Publication number: 20110108876Abstract: A pad structure includes a copper circuit pattern on a substrate, at least a gold layer stacked on the copper circuit pattern, and a nano-structured coating film stacked on the gold layer.Type: ApplicationFiled: January 11, 2010Publication date: May 12, 2011Inventor: Lee-Sheng Yen