Patents by Inventor Lee Teck Sim

Lee Teck Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe having mold lock vent
    Patent number: 7781899
    Abstract: A leadframe for supporting a semiconductor chip, the leadframe including a die pad having a first major surface and an opposing second major surface defining a thickness and having at least one perimeter edge, and an opening spaced from the at least one perimeter edge and extending through the thickness of the die pad between the first and second major surfaces. A vent extends from the at least one perimeter edge to the opening so that the opening is in communication with the at least one perimeter edge.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: August 24, 2010
    Assignee: Infineon Technologies AG
    Inventors: Lee Teck Sim, Yong Wae Chet, Bernd Goller, Lim Boon Kian
  • LEADFRAME HAVING MOLD LOCK VENT
    Publication number: 20090212404
    Abstract: A leadframe for supporting a semiconductor chip, the leadframe including a die pad having a first major surface and an opposing second major surface defining a thickness and having at least one perimeter edge, and an opening spaced from the at least one perimeter edge and extending through the thickness of the die pad between the first and second major surfaces. A vent extends from the at least one perimeter edge to the opening so that the opening is in communication with the at least one perimeter edge.
    Type: Application
    Filed: February 27, 2008
    Publication date: August 27, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Lee Teck Sim, Yong Wae Chet, Bernd Goller, Lim Boon Kian