Patents by Inventor Lee-Ting Hsieh

Lee-Ting Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8570234
    Abstract: An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: October 29, 2013
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Meng Hsueh Tsai, Chih Ming Su, Lee Ting Hsieh
  • Publication number: 20110291910
    Abstract: An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.
    Type: Application
    Filed: March 31, 2011
    Publication date: December 1, 2011
    Applicant: INPAO TECHNOLOGY CO., LTD.
    Inventors: MENG HSUEH TSAI, CHIH MING SU, LEE TING HSIEH
  • Publication number: 20110037655
    Abstract: A dielectric-loaded and coupled planar antenna includes a ground plane, a radiator, a ceramic substrate and at least one ground coupling electrode. The radiator is formed by extending one side of the ground plane, and a feeding point is formed between the radiator and the ground plane. The radiator extends at least one end portion on the ceramic substrate. The ground coupling electrode is formed on the ceramic substrate by extending the other side of the ground plane. The ground coupling electrode formed on the ceramic substrate and the end portion of the radiator formed on the ceramic substrate are coupled with each other to form a coupling electrode. The present invention can adjust the coupling amount loaded by the ceramic substrate so as to be operated in a desired frequency range. The present invention can be operated in a single-frequency, dual-frequency or multi-frequency condition.
    Type: Application
    Filed: August 17, 2009
    Publication date: February 17, 2011
    Inventors: Yueh-Lin Tsai, Sheng-Kai Wen, Chih-Wei Chen, Po-Chun Huang, Lee-Ting Hsieh
  • Patent number: 7800550
    Abstract: A dipole antenna array includes a dielectric substrate; electric tuning elements mounted on a first surface and a second surface of the dielectric substrate; resonance elements and ground elements; and a feed line. Each resonance element includes first resonance parts, second resonance parts and a third resonance part. One of the second resonance parts connects the corresponding first resonance part to the third resonance part. The other second resonance parts respectively connect two neighboring first resonance parts. Each ground element includes first ground parts, second ground parts and a third ground part. One of the second ground parts connects one of the first ground parts to the third ground part. The other second ground parts respectively connect to two neighboring first ground parts.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: September 21, 2010
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Lee-Ting Hsieh, Chih-Hao Lai
  • Publication number: 20090213024
    Abstract: A dipole antenna array includes a dielectric substrate; electric tuning elements mounted on a first surface and a second surface of the dielectric substrate; resonance elements and ground elements; and a feed line. Each resonance element includes first resonance parts, second resonance parts and a third resonance part. One of the second resonance parts connects the corresponding first resonance part to the third resonance part. The other second resonance parts respectively connect two neighboring first resonance parts. Each ground element includes first ground parts, second ground parts and a third ground part. One of the second ground parts connects one of the first ground parts to the third ground part. The other second ground parts respectively connect to two neighboring first ground parts.
    Type: Application
    Filed: February 27, 2008
    Publication date: August 27, 2009
    Inventors: Lee-Ting Hsieh, Chih-Hao Lai