Patents by Inventor Lee Topic

Lee Topic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
    Patent number: 6381136
    Abstract: An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: April 30, 2002
    Assignee: Intel Corporation
    Inventors: Daryl J. Nelson, Michael Stark, Michael Rutigliano, Lee Topic, Yoke Chung, Mark Thurston
  • Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
    Patent number: 6046905
    Abstract: An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: April 4, 2000
    Assignee: Intel Corporation
    Inventors: Daryl J. Nelson, Michael Stark, Michael Rutigliano, Lee Topic, Yoke Chung, Mark Thurston