Abstract: In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material's melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material's melting temperature while remaining connected to the structural body.

Abstract: In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material's melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material's melting temperature while remaining connected to the structural body.

Abstract: In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material's melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material's melting temperature while remaining connected to the structural body.

Abstract: In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material's melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material's melting temperature while remaining connected to the structural body.

Abstract: In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material's melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material's melting temperature while remaining connected to the structural body.