Abstract: Embodiments introduce redundant optical channels to significantly extend the lifetime of parallel optical transceivers. A plurality of transmitters, N, transmit on a plurality of optical channels, where N is an integer number of optical channels greater than 1. One or more redundant channels, M, are also provided. N+M multiple input shift registers provide multiple paths for signals from each of the transmitters to connect to N+M laser diodes. In the event up to M of the N+M laser diodes fail, the multiple input shift registers connect the N transmitters to functioning ones of the N+M laser diodes thus extending the life of the device. A corresponding scheme is also described for the receiver side.

Abstract: Embodiments introduce redundant optical channels to significantly extend the lifetime of parallel optical transceivers. A plurality of transmitters, N, transmit on a plurality of optical channels, where N is an integer number of optical channels greater than 1. One or more redundant channels, M, are also provided. N+M multiple input shift registers provide multiple paths for signals from each of the transmitters to connect to N+M laser diodes. In the event up to M of the N+M laser diodes fail, the multiple input shift registers connect the N transmitters to functioning ones of the N+M laser diodes thus extending the life of the device. A corresponding scheme is also described for the receiver side.

Abstract: An inlet includes a bottom assembly and a top assembly. The bottom assembly includes at least one male unit, and the top assembly has at least one beveled surface and includes at least one female unit and a lateral driving unit. The top assembly is placed inside the bottom assembly by aligning the female unit of the top assembly with the male unit of the bottom assembly. The lateral driving unit laterally drives the top assembly and causes the beveled surface of the top assembly to rise against the male unit of the bottom assembly, allowing the top assembly to seal with the bottom assembly.

Abstract: Disclosed herein are methods, apparatus, and systems to achieve substantially constant optical power and/or extinction ratio for a semiconductor laser. In one aspect, a microcontroller of an optical transmitter may adjust an electrical current that is provided to a semiconductor laser based at least in part on a comparison of a first measured optical power of light emitted by the semiconductor laser and a predetermined target optical power. The microcontroller may then determine an electrical current that is capable of giving the semiconductor laser a substantially constant extinction ratio by evaluating an equation with the first measured optical power and a second optical power measured after the controller adjusts the electrical current.

Abstract: A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.

Abstract: A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.

Abstract: A transceiver assembly includes a frame section, a rigid printed circuit board, a flex circuit, and an edge connector. The frame section includes a flex circuit layer for use in carrying data, and control and power signals, and an optoelectronic device. The rigid printed circuit board includes a first rigid printed circuit board layer and a flex circuit layer for use in carrying data, and control and power signals. The flex circuit is for carrying data, and control and power signals which flexibly links the rigid printed circuit board to the frame section and forms the flex circuit layers in the rigid printed circuit board and the frame section. The edge connector is formed on one end of the printed circuit board by a plurality of connection pads disposed along one edge of the printed circuit board.

Abstract: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.

Abstract: An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.

Abstract: A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.

Abstract: An inlet includes a bottom assembly and a top assembly. The bottom assembly includes at least one male unit, and the top assembly has at least one beveled surface and includes at least one female unit and a lateral driving unit. The top assembly is placed inside the bottom assembly by aligning the female unit of the top assembly with the male unit of the bottom assembly. The lateral driving unit laterally drives the top assembly and causes the beveled surface of the top assembly to rise against the male unit of the bottom assembly, allowing the top assembly to seal with the bottom assembly.

Abstract: A transceiver is disclosed. The transceiver includes a carrier assembly having active components to transmit and receive optical input/output (I/O); and a connector, coupled to the carrier assembly to couple optical I/O between the active components and a waveguide.

Abstract: A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.