Patents by Inventor Lee-Yin Chen

Lee-Yin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240089103
    Abstract: A device-verification system is configured to verify the authenticity of an electronic device using a digital signature of the electronic device verified by a certificate authority. In some examples, the electronic device includes a NFC tag storing device hardware information, device public and private keys, and a device digital signature ciphertext. A user may utilize a personal device to read the information from the NFC tag and the personal device may include a software application configured to communicate the information to a cloud-based certificate authority. The certificate authority may include a distributed system (e.g., a blockchain ledger) utilized to verify, store, and subsequently retrieve data corresponding to the electronic device. The certificate authority is configured to utilize the device digital signature to verify the authenticity of the device.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 14, 2024
    Inventors: Chao-Ying CHEN, Chiu-Hsiang HSU, Jian-Yin YE, Jack GUINCHARD, Lee GUINCHARD
  • Publication number: 20070065994
    Abstract: Ferroelectric thin film devices including a passivation structure to reduce or control a leakage path between two electrodes and along an interface between a ferroelectric thin film layer and a passivation layer are described. Methods for fabricating such devices are also disclosed. The passivation structure includes a first passivation layer that includes an opening exposing a portion of the ferroelectric thin film layer allowing a second passivation layer to contact the thin film layer through the opening. In an exemplary embodiment, the opening is a rectangular ring surrounding an active region of a capacitor. In another exemplary embodiment, the second passivation layer also contacts the second electrode, a portion of which is also exposed through the opening. In another exemplary embodiment, current flows along the interface between the thin film layer and the passivation layer in an integrated resistor.
    Type: Application
    Filed: September 7, 2006
    Publication date: March 22, 2007
    Applicant: Agile Materials and Technologies, Inc.
    Inventor: Lee-Yin Chen