Abstract: In those conventional arts, for large-size LCD, the process of copper damascene interconnect has some problems of forming a uneven copper seed layer and forming hollows during electrical plating due to the electrical plating area being too large to electroplate uniformly. In this invention, it employs a Cu tape to directly stick on a substrate to replace forming a copper seed layer and electroplating. Hence, the invention avoids the problem of unevenness and hollows in those conventional arts and so the Cu lines can be applied to the large-size LCD.

Abstract: The present invention relates to reduce contact impedance of a gate electrode of a thin film transistor (TFT). It employs a double layer of AlNd/Cr or AlNd/Cr silicide as a material of the gate electrode and employs plasma atmosphere to clean a contact surface of the gate electrode.

Abstract: The present invention relates to reduce contact impedance of a gate electrode of a thin film transistor (TFT). It employs a double layer of AlNd/Cr or AlNd/Cr silicide as a material of the gate electrode and employs plasma atmosphere to clean a contact surface of the gate electrode.

Abstract: In those conventional arts, for large-size LCD, the process of copper damascene interconnect has some problems of forming a uneven copper seed layer and forming hollows during electrical plating due to the electrical plating area being too large to electroplate uniformly. In this invention, it employs a Cu tape to directly stick on a substrate to replace forming a copper seed layer and electroplating. Hence, the invention avoids the problem of unevenness and hollows in those conventional arts and so the Cu lines can be applied to the large-size LCD.

Abstract: Ammonia gas plasma is introduced to surface of source and drain electrodes before formation of passivation layer on the source and drain electrodes to passivate the surface of the source and drain electrodes, to remove residues, particles, and oxide generated by antecedent etching step, and to saturate dangling bonds on surface of a channel region.