Patents by Inventor Lee

Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10511765
    Abstract: A method and an electronic device are provided for generating a still image from a video file. The electronic device includes an image sensor, a display, and a controller configured to generate a video file from an image signal input through the image sensor, assign frame characteristics to each frame included in the video file, selectively display at least one of the frames on the display, receive a selection of a frame among the displayed at least one of the frames, and generate a still image from the selected frame.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Goun-young Kim, Karthik Narayanan, Tapan Shah, Vamsee Kalyan Bandlamudi, Yun-mi Lee
  • Patent number: 10510170
    Abstract: An electronic device is provided. The electronic device includes a memory to store a plurality of images which are discontinuously captured and a processor to select at least some of the plurality of images, generate an image combination file in a format for sequentially playing the selected images by combining the selected images, and store the image combination file in the memory. The device can further provide a display to add, delete and arrange images of the image combination files.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ja Kyoung Lee, Kyu Ho Lee
  • Patent number: 10509937
    Abstract: A curved-surface OLED display device with fingerprint identification includes a substrate, a thin film transistor layer, a pixel electrode layer, an OLED display material layer, a common electrode layer, an encapsulation layer, a curved touch detection and fingerprint detection layer and a curved protective layer. The thin film transistor layer includes plural thin film transistors, plural scan lines, and plural data lines. The pixel electrode layer includes plural pixel electrodes. The curved touch detection and fingerprint detection layer includes plural sense electrodes and plural traces for performing the touch detection operation and fingerprint identification operation. A partial area of the curved touch detection and fingerprint detection layer and the curved protective layer exhibits a curved-surface shape.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: December 17, 2019
    Assignee: SUPERC-TOUCH CORPORATION
    Inventors: Hsiang-Yu Lee, Shang Chin, Ping-Tsun Lin, Chia-Hsun Tu
  • Patent number: 10511925
    Abstract: Disclosed is an apparatus and method for processing a multichannel audio signal. A multichannel audio signal processing method may include: generating an N-channel audio signal of N channels by down-mixing an M-channel audio signal of M channels; and generating a stereo audio signal by performing binaural rendering of the N-channel audio signal.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: December 17, 2019
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Ju Lee, Jeong Il Seo, Seung Kwon Beack, Kyeong Ok Kang, Jin Woong Kim, Jae Hyoun Yoo
  • Patent number: 10508731
    Abstract: A planet gear includes a pin and an annular planet gear rim. The pin has a pin radius. The pin includes a pin outer surface. The annular planet gear rim has an inner radius and an outer radius. The annular planet gear rim includes an inner surface and an outer surface. The inner surface and the pin outer surface define a clearance therebetween. The clearance is greater than 0 when a radial force is applied to the planet gear.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: December 17, 2019
    Assignee: General Electric Company
    Inventors: Darren Lee Hallman, Donald Albert Bradley, Changjie Sun, Bugra Han Ertas
  • Patent number: 10506909
    Abstract: Disclosed is a dishwasher having a structure improved to enhance the efficiency of washing. The dishwasher includes a main body, a washing tub provided in the main body, a door configured to close or open an open side of the washing tub, a fixed nozzle fixed on another side of the washing tub and configured to spray washing water, a vane configured to reflect the washing water sprayed via the fixed nozzle toward dishes while being moved within the washing tub, and a rail assembly configured to guide the movement of the vane. The vane is rotationally coupled to the rail assembly to change a direction of movement of the washing water sprayed via the fixed nozzle.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: December 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ki Tae Park, Sung Jin Kim, Chang Wook Lee, Heon Ho Jeong, Jae Man Joo
  • Patent number: 10507252
    Abstract: Some embodiments relate to nanoparticle probes for the detection of disease states in a patient or for tissue engineering. In some embodiments, the nanoparticle probe comprises one or more slip bonds that bind to a cell surface structure. In some embodiments, the binding of the nanoparticle probe is selective. In some embodiments, the nanoparticle probe binds to cells having a certain maximum glycocalyx thickness.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: December 17, 2019
    Inventor: Paul C. Lee
  • Patent number: 10510870
    Abstract: A method for forming a semiconductor device may include providing a transistor structure. The transistor structure may include a set of semiconductor fins and a set of gate structures, disposed on the set of semiconductor fins, wherein an isolation layer is disposed between the set of semiconductor fins and between the set of gate structures. The method may include implanting ions into an exposed area of the isolation layer, wherein an altered portion of the isolation layer is formed in the exposed area, wherein an altered region of the set of semiconductor fins is formed in an exposed portion of the set of semiconductor fins. The altered portion of the isolation layer may have a first etch rate, wherein an unaltered portion of the isolation layer, not exposed to the ions, has a second etch rate, greater than the first etch rate.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: December 17, 2019
    Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventors: Min Gyu Sung, Sony Varghese, Jae Young Lee, Johannes Van Meer
  • Patent number: 10509800
    Abstract: Visually interactive identification of a cohort of similar data objects is disclosed. One example is a system including a data processor to access a plurality of data objects, each data object comprising a plurality of numerical components, where each component represents a data feature of a plurality of data features, and to identify, for each data feature, a feature distribution of the numerical components. A selector selects a sub-plurality of the data features of a query object, where a given data feature is selected if the component representing the given data feature is a peak for the feature distribution. An evaluator determines a similarity measure based on the sub-plurality of the data features. An interaction processor iteratively processes selection of a sub-plurality of the data features based on domain knowledge, and identifies, based on the similarity measures, a cohort of data objects similar to the query object.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: December 17, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ming C Hao, Wei-Nchih Lee, Nelson L Chang, Michael Hund, Daniel Keim
  • Patent number: 10510606
    Abstract: A method for forming an integrated circuit (IC) package is provided. In some embodiments, a semiconductor workpiece comprising a scribe line, a first IC die, a second IC die, and a passivation layer is formed. The scribe line separates the first and second IC dies, and the passivation layer covers the first and second IC dies. The first IC die comprises a circuit and a pad structure electrically coupled to the circuit. The pad structure comprises a first pad, a second pad, and a bridge. The bridge is within the scribe line and connects the first pad to the second pad. The passivation layer is patterned to expose the first pad, but not the second pad, and testing is performed on the circuit through the first pad. The semiconductor workpiece is cut along the scribe line to individualize the first and second IC dies, and to remove the bridge.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yueh-Chuan Lee, Chia-Chan Chen, Ching-Heng Liu
  • Patent number: 10508183
    Abstract: The present invention relates to a plastic film and a method for manufacturing same. A plastic film, which is formed such that at least one part has a curved shape, can have high hardness, impact resistance, scratch resistance and high transparency. The plastic film is light and will not be easily damaged by external pressure and thus can substitute for the existing glass and is expected to be used for various electronic products such as a display and the like. In particular, the plastic film has at least one part in a curved shape and thereby is expected to be used for products in various shapes which cannot be manufactured by means of the existing glass. Moreover, a method for manufacturing a plastic film enables manufacturing of a plastic film having at least one part in a curved shape without curls or cracks as well as simultaneous performing of heat molding and heat curing, thereby increasing the productivity of a plastic film.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: December 17, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Han Na Lee, Young Suk Kim, Yeong Rae Chang, Heon Kim, Soon Hwa Jung, Jin Seok Byun
  • Patent number: 10511967
    Abstract: An electronic device is provided. The electronic device includes at least one communication module and a processor configured to control the at least one communication module. The processor is configured to verify properties of at least one communication network accessed by the electronic device through the at least one communication module, to determine an authentication scheme to be applied to a communication connection between the electronic device and an external electronic device and to establish the communication connection such that the external electronic device accesses the at least one communication network through the electronic device based on the authentication scheme.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki Seok Kang, Hong Chan Park, Gi Beom Kim, Sung Soo Park, Young Kow Lee, Hyuk Kang, In Ji Jin
  • Patent number: 10508144
    Abstract: The invention provides for mammalian cells capable of producing recombinant CTLA4-Ig and variants thereof. The invention also provides for compositions comprising CTLA4-Ig and formulations thereof. The invention further provides for methods for mass-producing CTLA4-Ig from mammalian cells capable of producing this recombinant protein, and for purifying the CTLA4-Ig.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: December 17, 2019
    Assignee: Bristol-Myers Squibb Company
    Inventors: Kirk J. Leister, Eugene J. Schaefer, Ronald Charles Bates, Elizabeth A. Bramhall, David Michael Didio, Robert Donaldson, Alan R. Flesher, Helen Gray Haggerty, David Henry Kirkley, John Malcolm Tabor, Lee K. Tay, Pallaiah Thammana, Ajoy Velayudhan, David Edward Smolin, Reb J. Russell, Thomas James Vanden Boom, Dean Woodrow Brownell, Jeffrey Schrimsher, Joyce Patricia Whitehead
  • Patent number: 10511095
    Abstract: An antenna module includes a coil part including a second antenna wiring formed on an insulating substrate in a spiral shape and a first antenna wiring disposed in an internal region of the second antenna wiring, and a magnetic part including a first magnetic part disposed in the internal region of a first surface of the insulating substrate and a second magnetic part disposed on a second surface of the insulating substrate.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: December 17, 2019
    Assignee: WITS Co., Ltd.
    Inventors: Chang Hee Lee, Young Seung Roh, Jae Sun Won, Hee Seung Kim, Hyo Jung Yoon, Gie Hyoun Kweon
  • Patent number: 10510585
    Abstract: A method includes forming a carbon-containing layer with a carbon atomic percentage greater than about 25 percent over a first hard mask layer, forming a capping layer over the carbon-containing layer, forming a first photo resist over the capping layer, and etching the capping layer and the carbon-containing layer using the first photo resist as a first etching mask. The first photo resist is then removed. A second photo resist is formed over the capping layer. The capping layer and the carbon-containing layer are etched using the second photo resist as a second etching mask. The second photo resist is removed. A third photo resist under the carbon-containing layer is etched using the carbon-containing layer as etching mask. A dielectric layer underlying the third photo resist is etched to form via openings using the third photo resist as etching mask. The via openings are filled with a conductive material.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Kai Chen, Jung-Hau Shiu, Chia Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen, Shing-Chyang Pan
  • Patent number: 10511177
    Abstract: A power delivery system includes: an AC-to-DC power supply configured to output initial DC power; a first power delivery unit connected to the power supply and having at least one output port, the first power delivery unit being configured as a DC-to-DC power converter to provide converted DC power through the at least one output port, the converted DC power having a different voltage and/or a different current than the output initial DC power; and a second power delivery unit connected to the power supply or the first power delivery unit through an input port and having at least one output port, the second power delivery unit being configured as a DC-to-DC power converter to provide an output DC power through the at least one output port which has a different voltage and/or a different current than the power received through the input port.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: December 17, 2019
    Assignee: Group Dekko, Inc.
    Inventors: Daniel Hayes, Kunvichet Lee
  • Patent number: 10510854
    Abstract: One or more semiconductor devices are provided. The semiconductor device comprises a gate body, a conductive prelayer over the gate body, at least one inhibitor film over the conductive prelayer and a conductive layer over the at least one inhibitor film, where the conductive layer is tapered so as to have a top portion width that is greater than the bottom portion width. One or more methods of forming a semiconductor device are also provided, where an etching process is performed to form a tapered opening such that the tapered conductive layer is formed in the tapered opening.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Mrunal A. Khaderbad, Hsueh Wen Tsau, Chia-Ching Lee, Da-Yuan Lee, Hsiao-Kuan Wei, Chih-Chang Hung, Huicheng Chang, Weng Chang
  • Patent number: D869913
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: December 17, 2019
    Inventor: Christopher Lee Tillman
  • Patent number: D870148
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 17, 2019
    Assignee: AVISION INC.
    Inventors: Kai-Chieh Chuang, Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D870163
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byeong-Cheol Yoon, Daekyun Lee