Patents by Inventor Leela Josephine Sequeira

Leela Josephine Sequeira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6936115
    Abstract: A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The lubricant additive is especially adapted for inclusion in a non-aqueous flux vehicle that is mixed with a solder alloy powder to make a solder paste used in the manufacture of printed circuit boards.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: August 30, 2005
    Assignee: Fry's Metals, Inc.
    Inventors: Deborah Mallon, Andrew David Price, Leela Josephine Sequeira, Robert Derek Williams
  • Publication number: 20030221748
    Abstract: The present invention is directed to a solder flux and solder paste that comprises methylsuccinic acid as an activating component and an imidazole compound as an accelerating component. The imidizole compound is selected from the following: 2-methyl-4-ethylimidazole, 2-methylimidazole and 2-ethylimidazole and mixtures thereof. The present invention is also directed to a method for preparing the above-described solder flux and method for soldering using the solder flux paste. It is also directed to an electronic component assembly joined using the solder flux paste.
    Type: Application
    Filed: May 30, 2002
    Publication date: December 4, 2003
    Applicant: Fry's Metals, Inc.
    Inventors: Bensol Arzadon, Andrew David Price, Leela Josephine Sequeira, Leszek Hozer
  • Publication number: 20020187264
    Abstract: A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The lubricant additive is especially adapted for inclusion in a non-aqueous flux vehicle that is mixed with a solder alloy powder to make a solder paste used in the manufacture of printed circuit boards.
    Type: Application
    Filed: December 21, 2001
    Publication date: December 12, 2002
    Applicant: Enthone, Inc.
    Inventors: Deborah Mallon, Andrew David Price, Leela Josephine Sequeira, Robert Derek Williams