Abstract: In one aspect, an electronic device that has been partitioned into segments by using clock gating or signal gating is tested. One of the segments that is a source of a failure is identified. Diagnostic procedures are applied to the identified segment to determine a cause of the failure.

Abstract: Systems, methods and apparatus are provided for isolating a defect in a scan chain. The invention includes modifying a first test mode of a plurality of latches included in a scan chain, operating the latches in the modified first test mode, and operating the plurality of latches included in the scan chain in a second test mode. A portion of the scan chain adjacent and following a stuck-@-0 or stuck-@-1 fault in the scan chain may store and/or output a value complementary to the value on the output of the previous portion of the scan chain due to the fault. Such values may be unloaded from the scan chain and used for diagnosing (e.g., isolating a defect in) the defective scan chain. Numerous other aspects are provided.

Abstract: A structure and method for optimzing scan chain fail disgnosis. First, logic paths from target latches in a target scan chain to observation latches in at least one other observation scan chain are identified. Then, the locations of the observation latches within the other scan chains are optimized.

Abstract: The present invention provides inspection methods and structures for facilitating the visualization and/or detection of specific chip structures. Optical or fluorescent labeling techniques are used to “stain” a specific chip structure for easier detection of the structure. Also, a temporary/sacrificial illuminating (e.g., fluorescent) film is added to the semiconductor process to facilitate the detection of a specific chip structure. Further, a specific chip structure is doped with a fluorescent material during the semiconductor process. A method of the present invention comprises: providing a first and a second material; processing the first material to form a portion of a semiconductor structure; and detecting a condition of the second material to determine whether processing of the first material is complete.

Abstract: A method for defect diagnosis of semiconductor chip. The method comprises the steps of (a) identifying M design structures and N physical characteristics of the circuit design, wherein M and N are positive integers, wherein each design structure of the M design structures is testable as to pass or fail, and wherein each physical characteristic of the N physical characteristics is present in at least one design structure of the M design structures; (b) for each design structure of the M design structures of the circuit design, determining a fail rate and determining whether the fail rate is high or low; and (c) if every design structure of the M design structures in which a physical characteristic of the N physical characteristics is present has a high fail rate, then flagging the physical characteristic as being likely to contain at least a defect.

Abstract: A method is disclosed for designing scan chains in an integrated circuit chip with specific parameter sensitivities to identify fabrication process defects causing test fails and chip yield loss. The composition of scan paths in the integrated circuit chip is biased to allow them to also function as on-product process monitors. The method adds grouping constraints that bias scan chains to have common latch cell usage where possible, and also biases cell routing to constrain scan chain routing to given restricted metal layers for interconnects. The method assembles a list of latch design parameters which are sensitive to process variation or integrity, and formulates a plan for scan chain design which determines the number and the length of scan chains. A model is formulated of scan chain design based upon current state of yield and process integrity, wherein certain latch designs having dominant sensitivities are chosen for specific ones of the scan chains on the chip.

Abstract: A system and method for diagnosing a failure in an electronic device. A disclosed system comprises: a defect table that associates previously studied features with known failures; and a fault isolation system that compares an inputted set of suspected faulty device features with the previously studied features listed in the defect table in order to identify causes of the failure.

Abstract: In a first aspect, a first method is provided for isolating a defect in a scan chain. The first method includes the steps of (1) modifying a first test mode of one or more of a plurality of latches included in the scan chain; (2) operating the one or more latches whose first test modes are modified in the modified first test mode; and (3) operating one or more of the plurality of latches included in the scan chain in a second test mode. Numerous other aspects are provided.

Abstract: A method is disclosed of diagnosing defects in scan chains by statically and dynamically segmenting and reconfiguring the scan chains. A plurality of serially extending scan chains are partitioned into a plurality of serially arranged equal length segments such that each serially extending scan chain comprises a plurality of serially extending segments. A plurality of multiplexors are positioned between the plurality of segments of each scan chain, and are controlled and utilized to connect each segment of the scan chain to the next serial segment in the same scan chain, or to connect each segment of the scan chain to the next serial segment in a lateral adjacent scan chain. Scan in data patterns are introduced into the plurality of serially extending scan chains.

Abstract: A structure and method for performing scan chain diagnosis. The structure comprises a diagnosed/target scan chain and one or more good observation scan chains. Observing logic paths from the target scan chain to observation scan chains can be identified according to a pre-specified criterion. The diagnosed scan chain is loaded in series with a test pattern. Then, the contents of the observed latch(es) in the diagnosed scan chain propagate through the observing logic paths. Then, the output signals of the observing logic paths are strobed into the observing latch(es) in the observing scan chain(s). Then, the observing scan chain(s) are unloaded and the contents of the observing latch(es) are collected and analyzed to determine the defect types and the defect ranges in the diagnosed scan chain.

Abstract: In one aspect, an electronic device that has been partitioned into segments by using clock gating or signal gating is tested. One of the segments that is a source of a failure is identified. Diagnostic procedures are applied to the identified segment to determine a cause of the failure.