Patents by Inventor Legend Xin

Legend Xin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
    Publication number: 20230377972
    Abstract: A die separation ring that causes non-uniform expansion of a semiconductor wafer during a semiconductor wafer expansion process. The die separation ring includes an annular body that extends about a central axis. The annular body of the die separation ring includes a first portion having a first elevation and a second portion having a second elevation that is lower than the first elevation. A third portion extends between the first portion and the second portion forming a transition between the first portion and the second portion.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Shuo Li, Jacky Liu, Lance Liu, Legend Xin, Weiting Jiang, Zhenghao Wu, Bo Yang