Patents by Inventor Lei Fukuda

Lei Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having wettable lead flank and method of making the same
    Patent number: 11581195
    Abstract: A semiconductor package comprises a lead frame, a chip, and a molding encapsulation. The lead frame comprises one or more die paddles, a first plurality of leads, and a second plurality of leads. A respective end surface of each lead of the first plurality of leads and the second plurality of leads is plated with a metal. A first respective window on a first side of each lead of the first plurality of leads and the second plurality of leads is not plated with the metal. A second respective window on a second side of each lead of the first plurality of leads and the second plurality of leads is not plated with the metal. A method for fabricating a semiconductor package comprises the steps of providing a lead frame array, mounting a chip, forming a molding encapsulation, and applying a cutting process or a punching process.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 14, 2023
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
    Inventors: Yan Xun Xue, Long-Ching Wang, Lei Fukuda, Adrian Chee Heong Koh, Peter Wilson, Feng Ye
  • SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKING THE SAME
    Publication number: 20220199425
    Abstract: A semiconductor package comprises a lead frame, a chip, and a molding encapsulation. The lead frame comprises one or more die paddles, a first plurality of leads, and a second plurality of leads. A respective end surface of each lead of the first plurality of leads and the second plurality of leads is plated with a metal. A first respective window on a first side of each lead of the first plurality of leads and the second plurality of leads is not plated with the metal. A second respective window on a second side of each lead of the first plurality of leads and the second plurality of leads is not plated with the metal. A method for fabricating a semiconductor package comprises the steps of providing a lead frame array, mounting a chip, forming a molding encapsulation, and applying a cutting process or a punching process.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Applicant: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
    Inventors: Yan Xun Xue, Long-Ching Wang, Lei Fukuda, Adrian Chee Heong Koh, Peter Wilson, Feng Ye