Patents by Inventor Lei Liao

Lei Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12249778
    Abstract: PSAS 5.0 female connector includes a framework member having a main conductive plastic, a terminal member, and a cover member; the terminal member is inserted in the framework member and includes a SATA 7Pin terminal set having a SATA 7Pin terminal, a plastic frame member, and a SATA 7Pin conductive plastic; the SATA 7Pin terminal is inserted in the plastic frame member, and the SATA 7Pin conductive plastic is engaged on the plastic frame member for fastening the SATA 7Pin terminal in the plastic frame member; the cover member includes a SATA 7Pin outer cover plate stably attached to one side of the plastic frame member and a SATA 7Pin inner cover plate stably attached to another side of the SATA 7Pin conductive plastic. The present invention resolves the insufficiency of transmission rate fulfills multiple high frequency performance.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: March 11, 2025
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Yan-Bin Tan, Xiang Wang, Lei Liao, Wei Luo
  • Publication number: 20250069895
    Abstract: Exemplary semiconductor processing methods may include providing a fluorine-containing precursor and a hydrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be housed in the processing region. A layer of a silicon-containing material may be disposed on the substrate. The methods may include forming plasma effluents of the fluorine-containing precursor and the hydrogen-containing precursor. The methods may include contacting the substrate with the plasma effluents of the fluorine-containing precursor and the hydrogen-containing precursor. The contacting may etch a feature in the layer of silicon-containing material. A substrate support pedestal temperature may be maintained at less than or about ?20° C. during the semiconductor processing method.
    Type: Application
    Filed: August 21, 2023
    Publication date: February 27, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Anatoli Chlenov, Kenji Takeshita, Alok Ranjan, Qian Fu, Hikaru Watanabe, Akhil Mehrotra, Lei Liao, Zhonghua Yao, Sonam Dorje Sherpa
  • Publication number: 20250039490
    Abstract: A vehicle-mounted interaction content calling control method includes: step S11: the interaction engine receives an interaction content calling request, and queries a corresponding relation between an interaction content stored by the interaction engine and an interaction content calling device in response to the interaction content calling request and according to interaction content ID included in the interaction content calling request to obtain one or more interaction content calling devices corresponding to the interaction content, and an address of the interaction content; and step S12: the interaction engine sends the address of the interaction content to the interaction content calling device for the interaction content calling device to obtain and exhibit the interaction content according to the address of the interaction content.
    Type: Application
    Filed: September 26, 2022
    Publication date: January 30, 2025
    Inventor: Lei LIAO
  • Patent number: 12132282
    Abstract: A Peripheral Component Interconnect Express/Serial Attached SCSI (PSAS) female connector includes a frame member, a terminal member, and a cover member; the frame member including a terminal groove disposed in the frame member and a tilt portion disposed in the terminal groove adjacent to a plug end; the terminal member inserted in the frame member and including a Serial Advanced Technology Attachment (SATA) 7 pin terminal, a Serial Attached SCSI (SAS) 40 pin terminal, a 15 Pin signal terminal, a 6 Pin terminal, and a 4 Pin terminal. When the PSAS female connector is engaged with the male connector, the SATA 7 Pin terminal and the SAS 40 Pin terminal are pressed by a terminal of the male connector to be bent toward an outer lateral side of the terminal groove to contact the elastic plate of the cover member. The present invention effectively improves the cross interference during high speed transmission, thereby achieving the Generation 5 performance requirement.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: October 29, 2024
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Xiang Wang, Yan-Bin Tan, Lei Liao, Wei Luo
  • Publication number: 20240356287
    Abstract: The connector provides high performance transmission for high speed signals. The connector includes a subassembly having a subassembly housing holding conductive elements in a row and a shield disposed on the subassembly housing. The subassembly housing includes openings to ground conductive elements. The shield has ribs extending into the openings and contacting the ground conductors. The subassembly can have a second shield disposed closer to a mating face than the shield disposed on the subassembly housing. The second shield is configured to move with the mating ends of the conductive elements when a mating component is inserted into the connector. The connector has a housing with an opening positioned in a moving path of the second shield. Such a configuration meets signal integrity requirements in connectors design for 64 Gbps and beyond, while conforming to a standard that constrains connector physical dimensions.
    Type: Application
    Filed: April 17, 2024
    Publication date: October 24, 2024
    Applicant: Amphenol Commerical Products (Chengdu) Co., Ltd.
    Inventors: Xiaodong Hu, Lei Liao, Teng Cao
  • Publication number: 20240286036
    Abstract: A game control method, a terminal, a device, and a storage medium. The method comprises: configuring an article backpack for storing a virtual article for a target virtual character, an equipment bar for equipping weapons and equipment and a tool bar for equipping a survival tool; in a case that the target virtual character obtains the survival tool, adding the survival tool into the tool bar; and in a case that the target virtual character triggers a target survival project, controlling the target virtual character to complete the target survival project. According to the method, a new operation mode and a new function mode are added to the character, the article storage pressure of the article backpack is effectively reduced, and the frequency of cleaning the article backpack is reduced.
    Type: Application
    Filed: September 26, 2022
    Publication date: August 29, 2024
    Inventor: Lei Liao
  • Publication number: 20240162663
    Abstract: A connector for use with high-speed signals. The connector has a housing, which includes conductive elements held in a row by a housing. Each conductive element includes a thinner portion and a thicker portion. The conductive elements are configured to make contact with a mating component at the thicker portions. The thinner portions are closer to mating ends of respective conductive elements than respective thicker portions. The housing is configured to provide voids selectively disposed underneath the conductive elements. Such a configuration increases impedances for the conductive elements at locations that would otherwise have lower impedance and therefore reduces impedance variations along signal transmission paths. Such a configuration can also reduce stub size and therefore reduce insertion loss. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Kui Yang, Xiaodong Hu, Yaohua Hou, Lei Liao
  • Patent number: 11949180
    Abstract: A PCIe/SAS connector structure includes a female part and a male part; the female part is engaged with the male part; wherein the female part has a female plastic member, a female cover, a female signal terminal part, a fix pin and a female signal and power terminal; wherein the male part has a male plastic member, a male cover, a male signal and power terminal, a male terminal, and a fix plate; wherein the female cover is in a full-wrap structure; wherein the female cover has a protruding elastic plate, respectively; wherein the male terminal is formed in an L shape; two male terminals are fixed as a set by a plastic; the male terminal is inserted to be positioned in the male cover; wherein the male cover is formed in an L shape in a full-wrap structure. Interference performance of signal terminal is improved.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: April 2, 2024
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Xiang Wang, Yan-Bin Tan, Lei Liao, Wei Luo, Jing-Tang Zhou
  • Patent number: 11929446
    Abstract: Provided is a preparation method of a detector material. The present disclosure epitaxially grows a buffer layer on a surface of a gallium arsenide substrate, deposits a silicon dioxide layer on the buffer layer, and etches the silicon dioxide layer on the buffer layer according to a strip pattern by photolithography and etching to form strip growth regions with continuous changes in width. Finally, a molecular beam epitaxy (MBE) technology is used to epitaxially grow the detector material in the strip growth regions under set epitaxy growth conditions. Because of the same mobility of atoms arriving at the surface of the substrate, numbers of atoms migrating to the strip growth regions are different due to different widths of the strip growth regions, such that compositions of the material change with the widths of the strip growth regions or a layer thickness changes with the widths of the strip growth regions.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: March 12, 2024
    Assignee: CHANGCHUN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Qun Hao, Zhipeng Wei, Jilong Tang, Huimin Jia, Lei Liao, Kexue Li, Fengyuan Lin, Rui Chen, Shichen Su, Shuangpeng Wang
  • Publication number: 20240079829
    Abstract: A connector for use with high-speed signals. The connector includes conductive elements held in a row by an insulative member, a shielding member stacked on the insulative member, and a lossy member stacked on the shielding member and electrically connecting the shielding member to selected ones of the conductive elements. Each conductive element includes a mating end and a mounting end opposite the mating end. The insulative member includes first and second edges extending parallel to the row. The first edge and second edge are closer to the mating ends and mounting ends of the conductive elements, respectively. The shielding member includes a portion projecting from the first edge to provide shielding to the conductive elements beyond the first edge of the insulative member. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 7, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Teng Cao, Xiaodong Hu, Lei Liao
  • Publication number: 20240079827
    Abstract: A connector for use with high-speed signals. The connector includes a connector subassembly that includes conductive elements held in a row by an insulative member. Each conductive element includes a mating end, a mounting end opposite the mating end, and an intermediate portion extending therebetween. The conductive elements include ground conductors dispersed between pairs of signal conductors. The ground conductors are wider than the signal conductors at the intermediate portions, and have same widths as the signal conductors at the ends. For each ground conductor, the intermediate portion has first and second portions separated by a slot until joining each other at the mating end. The insulative member holds the conductive elements at least partially through the slots of the ground conductors. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 7, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Teng Cao, Xiaodong Hu, Lei Liao
  • Publication number: 20240071773
    Abstract: Exemplary methods of semiconductor processing may include forming a layer of silicon-containing material on a semiconductor substrate. The methods may include performing a post-formation treatment on the layer of silicon-containing material to yield a treated layer of silicon-containing material. The methods may include contacting the treated layer of silicon-containing material with an adhesion agent. The methods may include forming a layer of a resist material on the treated layer of silicon-containing material.
    Type: Application
    Filed: August 11, 2023
    Publication date: February 29, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Lei Liao, Yichuan Ling, Zhiyu Huang, Hideyuki Kanzawa, Fenglin Wang, Rajesh Prasad, Yung-Chen Lin, Chi-I Lang, Ho-yung David Hwang, Lequn Liu
  • Publication number: 20240072494
    Abstract: A connector for use with high-speed signals. The connector includes a connector subassembly having conductors disposed in groups and a shielding shell at least partially encircling each group. Each conductor includes a mating end and a mounting end opposite the mating end. The shielding shell includes openings that expose contact surfaces of the conductors at the ends. The shielding shell is formed by attaching a second shell part to a first shell part. The first shell part has plateaus and valleys, and the second shell part is attached to the first shell part at the valleys, such that tubular structures are formed. The shielding shell includes contact surfaces disposed on the same planes with the contact surfaces of the conductors at the ends, respectively. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: July 19, 2023
    Publication date: February 29, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Rui He, Xiaodong Hu, Yaohua Hou, Lei Liao
  • Patent number: 11894628
    Abstract: A PCIe SAS direct link connector includes a cable end and a back board; the cable end fixed on the back board and including a direct link female head, a high-speed line, and a 15pin plug terminal; the back board including a primary and a secondary cavity position; the direct link female head connected with the high-speed line; the 15pin plug terminal being an asymmetric bow shape and having a short and a long side, a first contact point disposed on the short side, and a second contact point disposed on the long side; the 15pin plug terminal connected with the high-speed line; when the 15pin plug terminal is combined with a server board end connector, the first contact point and the second contact point contact a terminal of the server board end connector, respectively, simplifying the connection structure and improving heat dissipation.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: February 6, 2024
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Xiang Wang, Yan-Bin Tan, Lei Liao
  • Publication number: 20230395743
    Abstract: Provided is a preparation method of a detector material. The present disclosure epitaxially grows a buffer layer on a surface of a gallium arsenide substrate, deposits a silicon dioxide layer on the buffer layer, and etches the silicon dioxide layer on the buffer layer according to a strip pattern by photolithography and etching to form strip growth regions with continuous changes in width. Finally, a molecular beam epitaxy (MBE) technology is used to epitaxially grow the detector material in the strip growth regions under set epitaxy growth conditions. Because of the same mobility of atoms arriving at the surface of the substrate, numbers of atoms migrating to the strip growth regions are different due to different widths of the strip growth regions, such that compositions of the material change with the widths of the strip growth regions or a layer thickness changes with the widths of the strip growth regions.
    Type: Application
    Filed: November 8, 2022
    Publication date: December 7, 2023
    Inventors: Qun HAO, Zhipeng WEI, Jilong TANG, Huimin JIA, Lei LIAO, Kexue LI, Fengyuan LIN, Rui Chen, Shichen SU, Shuangpeng WANG
  • Publication number: 20230378675
    Abstract: A USB type-C female connector includes an inner and an outer iron case, a terminal set, a plastic member, and a middle steel plate. The terminal set includes a terminal set A and a terminal set B. The terminal set A and terminal set B are in an upper and a lower terminal groove, respectively; the middle steel plate is in the middle steel plate slot. The plastic member is in the inner iron case; the inner iron case is in the outer iron case. The grounding terminal and the power terminal are formed of highly conductive copper material having a 0.20 to 0.30 mm thickness and a conductivity over 80%. The tongue plate area of the second terminal foot set A and second terminal foot set B facing the middle steel plate is thinned by 0.02 mm, improving impedance and optimizing insertion loss and return loss.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Inventors: ZE-FENG LAI, ZHI-MIN QIN, GENG-GENG CHEN, LEI LIAO
  • Patent number: 11817655
    Abstract: An electrical connector including a front housing member, signal and ground terminals disposed in a row in the front housing member, a cover member mounted to a rear of the front housing member, and a lossy member disposed in the cover member and contacting the ground terminals. Such a configuration improves signal integrity of the electronical connector while simplifying the manufacture and assembly of the electrical connector and reducing the cost thereof.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: November 14, 2023
    Assignee: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Yunxiang Liu, Lei Liao, Luyun Yi
  • Publication number: 20230215735
    Abstract: A method of forming features over a semiconductor substrate is provided. The method includes supplying a gas mixture over a surface of a substrate at a continuous flow rate. A first radio frequency (RF) signal is delivered to an electrode while the gas mixture is supplied at the continuous flow rate to deposit a polymer layer over the surface of the substrate. The surface of the substrate includes an oxide containing portion and a nitride containing portion. A second RF signal is delivered to the electrode while continuously supplying the gas mixture at the continuous flow rate to selectively etch the oxide containing portion relative to the nitride containing portion.
    Type: Application
    Filed: November 14, 2022
    Publication date: July 6, 2023
    Inventors: Lei LIAO, Yung-chen LIN, Chi-I LANG, Ho-yung David HWANG
  • Publication number: 20230132094
    Abstract: A connector for use with high-speed signals. The connector includes conductors held in a housing having a slot for receiving a mating component. Each conductor has a mating end curving into the slot and a mounting end extending out of the housing. The connector has a conductive shell at least partially enclosing the housing. The conductive shell covers one or more sides of the slot and substantially overlaps the mounting ends viewing from a top of the mounting interface to provide shielding to the mating and mounting interfaces. The conductive shell is coupled to ground through ground conductors of the connector. The connector has a lossy member disposed adjacent the mounting interface and coupled to the ground conductors. Such a configuration meets signal integrity requirements in connectors designed for 32 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 27, 2023
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Yunxiang Liu, Lei Liao, Luyun Yi
  • Publication number: 20230124724
    Abstract: PSAS 5.0 female connector includes a framework member having a main conductive plastic, a terminal member, and a cover member; the terminal member is inserted in the framework member and includes a SATA 7Pin terminal set having a SATA 7Pin terminal, a plastic frame member, and a SATA 7Pin conductive plastic; the SATA 7Pin terminal is inserted in the plastic frame member, and the SATA 7Pin conductive plastic is engaged on the plastic frame member for fastening the SATA 7Pin terminal in the plastic frame member; the cover member includes a SATA 7Pin outer cover plate stably attached to one side of the plastic frame member and a SATA 7Pin inner cover plate stably attached to another side of the SATA 7Pin conductive plastic. The present invention resolves the insufficiency of transmission rate fulfills multiple high frequency performance.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 20, 2023
    Applicant: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Yan-Bin Tan, Xiang Wang, Lei Liao, Wei Luo