Patents by Inventor Lei Liao

Lei Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129665
    Abstract: The present application discloses a sound-output device, including a signal processing circuit, configured to generate a bone-conducted control signal and an air-conducted control signal based on an initial sound signal; a vibration speaker, configured to generate a bone-conducted sound wave based on the bone-conducted control signal; and an air-conduction speaker, configured to generate an air-conducted sound wave based on the air-conducted control signal, wherein a signal component of at least partial frequency band in the air-conducted control signal has an amplitude and a phase canceling at least partial leakage of sound generated by the vibration speaker, such that at least partial component in the air-conducted sound wave cancels the at least partial leakage of sound.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 18, 2024
    Applicant: Shenzhen Shokz Co., Ltd.
    Inventors: Lei ZHANG, Junjiang FU, Fengyun LIAO, Xin QI
  • Publication number: 20240126402
    Abstract: The present disclosure relates to the technical field of multimedia, and in particular, to a control method and apparatus for multimedia content display, an electronic device, and a medium. First multimedia content is displayed on a first page; and in response to a terminal device changing in a preset attitude, the first page is switched to a second page, and second multimedia content is displayed on the second page. That is, the switching of the first page to the second page is implemented by triggering the attitude change of the terminal device, thereby improving the interestingness of user interaction.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Xue YAO, Qing SONG, Licong SONG, Yu SUN, Honghui LIAO, Jingjing ZHAO, Ji LIU, Lei JIN, Ling YANG, Mengqi WU
  • Patent number: 11956591
    Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a first acoustic driver including a first diaphragm; a second acoustic driver including a second diaphragm; a control circuit electrically connected with the first acoustic driver and the second acoustic driver respectively, the control circuit provides a first electrical signal for driving a vibration of the first diaphragm, and a second electrical signal for driving a vibration of the second diaphragm, and a phase of the first electrical signal and a phase of the second electrical signal are opposite; and a housing supporting the first acoustic driver and the second acoustic driver, wherein a sound generated by the vibration of the first diaphragm is radiated outward through a first sound guide hole on the housing, and a sound generated by the vibration of the second diaphragm is radiated outward through a second sound guide hole on the housing.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang Fu, Lei Zhang, Xin Qi, Fengyun Liao
  • Patent number: 11956603
    Abstract: The present application discloses a sound-output device, including a vibration speaker configured to generate a bone-conducted sound wave; and an air-conducted speaker configured to generate an air-conducted sound wave. The sound-output device further comprises a signal processing module configured to generate a control signal, wherein, the vibration speaker includes a vibration assembly electrically connected to the signal processing module to receive the control signal, and generate the bone-conducted sound wave based on the control signal, and the air-conducted speaker includes a housing coupled to the vibration assembly to generate the air-conducted sound wave based on the bone-conducted sound wave.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: April 9, 2024
    Assignee: Shenzhen Shokz Co., Ltd.
    Inventors: Lei Zhang, Junjiang Fu, Fengyun Liao, Xin Qi
  • Patent number: 11946350
    Abstract: A method for remotely shutting down a downhole unit of a rotary steering system from ground includes steps of: a: calculating a pressure difference P1 between a front end and a rear end of the drill water hole; b: calculating an extension loss ?P; c: calculating a pressure P2 at the riser after turning on the downlink device; d: calculating an opening area S1 of the throttle valve of the downlink device; and e: adjusting the throttle valve to a calculated opening degree; automatically targeting the function block that needs to be cut off according to a flow change detected downhole, and shutting down the downhole unit. The method can realize self-protection and continuous operation of the entire rotary steering system, reduce frequency of inspection that needs to pull back the drill when the rotary steering system is abnormal, improve drilling efficiency, and reduce costs.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: April 2, 2024
    Assignees: CHINA NATIONAL PETROLEUM CORPORATION, CNPC CHUANQING DRILLING ENGINEERING COMPANY LIMITED
    Inventors: Jing Bai, Jichuan Zhang, Dengyun Lu, Lei Li, Chongjun Huang, Lichun Jia, Chong Liao, Liexiang Han, Dejun Zhang, Gui Tang
  • Patent number: 11950055
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 2, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Fengyun Liao, Xin Qi
  • Patent number: 11949180
    Abstract: A PCIe/SAS connector structure includes a female part and a male part; the female part is engaged with the male part; wherein the female part has a female plastic member, a female cover, a female signal terminal part, a fix pin and a female signal and power terminal; wherein the male part has a male plastic member, a male cover, a male signal and power terminal, a male terminal, and a fix plate; wherein the female cover is in a full-wrap structure; wherein the female cover has a protruding elastic plate, respectively; wherein the male terminal is formed in an L shape; two male terminals are fixed as a set by a plastic; the male terminal is inserted to be positioned in the male cover; wherein the male cover is formed in an L shape in a full-wrap structure. Interference performance of signal terminal is improved.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: April 2, 2024
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Xiang Wang, Yan-Bin Tan, Lei Liao, Wei Luo, Jing-Tang Zhou
  • Patent number: 11930314
    Abstract: The present disclosure may provide an acoustic device. The acoustic device may include a housing, at least one low-frequency acoustic driver, at least one high-frequency acoustic driver, and a noise reduction assembly. The housing may be configured to be rested on a shoulder of a user. The at least one low-frequency acoustic driver may be carried by the housing and configured to output first sound from at least two first sound guiding holes. The at least one high-frequency acoustic driver may be carried by the housing and configured to output second sound from at least two second sound guiding holes. The noise reduction assembly may be configured to receive third sound and reduce noise of the third sound.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: March 12, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Patent number: 11929446
    Abstract: Provided is a preparation method of a detector material. The present disclosure epitaxially grows a buffer layer on a surface of a gallium arsenide substrate, deposits a silicon dioxide layer on the buffer layer, and etches the silicon dioxide layer on the buffer layer according to a strip pattern by photolithography and etching to form strip growth regions with continuous changes in width. Finally, a molecular beam epitaxy (MBE) technology is used to epitaxially grow the detector material in the strip growth regions under set epitaxy growth conditions. Because of the same mobility of atoms arriving at the surface of the substrate, numbers of atoms migrating to the strip growth regions are different due to different widths of the strip growth regions, such that compositions of the material change with the widths of the strip growth regions or a layer thickness changes with the widths of the strip growth regions.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: March 12, 2024
    Assignee: CHANGCHUN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Qun Hao, Zhipeng Wei, Jilong Tang, Huimin Jia, Lei Liao, Kexue Li, Fengyuan Lin, Rui Chen, Shichen Su, Shuangpeng Wang
  • Publication number: 20240079829
    Abstract: A connector for use with high-speed signals. The connector includes conductive elements held in a row by an insulative member, a shielding member stacked on the insulative member, and a lossy member stacked on the shielding member and electrically connecting the shielding member to selected ones of the conductive elements. Each conductive element includes a mating end and a mounting end opposite the mating end. The insulative member includes first and second edges extending parallel to the row. The first edge and second edge are closer to the mating ends and mounting ends of the conductive elements, respectively. The shielding member includes a portion projecting from the first edge to provide shielding to the conductive elements beyond the first edge of the insulative member. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 7, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Teng Cao, Xiaodong Hu, Lei Liao
  • Publication number: 20240078638
    Abstract: Provided are an image fusion method and apparatus, an electronic device, and a storage medium. The method includes the following steps: A shooting operation acting on a first page of a target shooting activity is received, where the first page is an H5 page; in response to the shooting operation, a camera is called through system shooting software to collect an original image; a fusion operation for the original image is received; and in response to the fusion operation, the original image is fused with a first target effect, a static target image that includes a static image obtained by fusing the original image with the first target effect and the first description information related to the static image is generated, and the static target image is displayed on a second page, where the second page is an H5 page.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Inventors: Honghui LIAO, Guangying SU, Weipeng WANG, Tong WU, Feng CHEN, Lei HUANG, Bei WANG, Yiqi XIAO, Yalong LIU
  • Publication number: 20240079827
    Abstract: A connector for use with high-speed signals. The connector includes a connector subassembly that includes conductive elements held in a row by an insulative member. Each conductive element includes a mating end, a mounting end opposite the mating end, and an intermediate portion extending therebetween. The conductive elements include ground conductors dispersed between pairs of signal conductors. The ground conductors are wider than the signal conductors at the intermediate portions, and have same widths as the signal conductors at the ends. For each ground conductor, the intermediate portion has first and second portions separated by a slot until joining each other at the mating end. The insulative member holds the conductive elements at least partially through the slots of the ground conductors. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 7, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Teng Cao, Xiaodong Hu, Lei Liao
  • Publication number: 20240073579
    Abstract: The present disclosure discloses an acoustic output apparatus. The acoustic output apparatus may include at least one acoustic driver. The at least one acoustic driver may generate sound that is output through at least two sound guiding holes. Further, the acoustic output apparatus may include a supporting structure. The supporting structure may be configured to support the at least one acoustic driver. A baffle may be disposed between the at least two sound guiding holes. The baffle may increase an acoustic distance from at least one sound guiding hole of the at least two sound guiding holes to a user's ear.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei ZHANG, Junjiang FU, Bingyan YAN, Fengyun LIAO, Xin QI
  • Publication number: 20240071773
    Abstract: Exemplary methods of semiconductor processing may include forming a layer of silicon-containing material on a semiconductor substrate. The methods may include performing a post-formation treatment on the layer of silicon-containing material to yield a treated layer of silicon-containing material. The methods may include contacting the treated layer of silicon-containing material with an adhesion agent. The methods may include forming a layer of a resist material on the treated layer of silicon-containing material.
    Type: Application
    Filed: August 11, 2023
    Publication date: February 29, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Lei Liao, Yichuan Ling, Zhiyu Huang, Hideyuki Kanzawa, Fenglin Wang, Rajesh Prasad, Yung-Chen Lin, Chi-I Lang, Ho-yung David Hwang, Lequn Liu
  • Publication number: 20240072494
    Abstract: A connector for use with high-speed signals. The connector includes a connector subassembly having conductors disposed in groups and a shielding shell at least partially encircling each group. Each conductor includes a mating end and a mounting end opposite the mating end. The shielding shell includes openings that expose contact surfaces of the conductors at the ends. The shielding shell is formed by attaching a second shell part to a first shell part. The first shell part has plateaus and valleys, and the second shell part is attached to the first shell part at the valleys, such that tubular structures are formed. The shielding shell includes contact surfaces disposed on the same planes with the contact surfaces of the conductors at the ends, respectively. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.
    Type: Application
    Filed: July 19, 2023
    Publication date: February 29, 2024
    Applicant: Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Rui He, Xiaodong Hu, Yaohua Hou, Lei Liao
  • Patent number: 11917352
    Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include at least one acoustic driver configured to generate sounds and a housing structure configured to carry the at least one acoustic driver. The housing structure may include a cavity, and the at least one acoustic driver may be arranged in the cavity and may divide the cavity into a first cavity and a second cavity. And the sounds generated by the at least one acoustic driver may be transmitted from the first cavity and the second cavity, respectively, pass through the housing structure, and form dual sound sources arranged on two sides of an auricle, respectively.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: February 27, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Patent number: 11917377
    Abstract: The present application discloses a sound-output device, including a vibration speaker configured to generate a bone-conducted sound wave; and an air-conducted speaker configured to generate an air-conducted sound wave. The sound-output device further comprises a signal processing module configured to generate a control signal, wherein, the vibration speaker includes a vibration assembly electrically connected to the signal processing module to receive the control signal, and generate the bone-conducted sound wave based on the control signal, and the air-conducted speaker includes a housing coupled to the vibration assembly to generate the air-conducted sound wave based on the bone-conducted sound wave.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: February 27, 2024
    Assignee: Shenzhen Shokz Co., Ltd.
    Inventors: Lei Zhang, Junjiang Fu, Fengyun Liao, Xin Qi
  • Patent number: 11894628
    Abstract: A PCIe SAS direct link connector includes a cable end and a back board; the cable end fixed on the back board and including a direct link female head, a high-speed line, and a 15pin plug terminal; the back board including a primary and a secondary cavity position; the direct link female head connected with the high-speed line; the 15pin plug terminal being an asymmetric bow shape and having a short and a long side, a first contact point disposed on the short side, and a second contact point disposed on the long side; the 15pin plug terminal connected with the high-speed line; when the 15pin plug terminal is combined with a server board end connector, the first contact point and the second contact point contact a terminal of the server board end connector, respectively, simplifying the connection structure and improving heat dissipation.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: February 6, 2024
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Xiang Wang, Yan-Bin Tan, Lei Liao
  • Patent number: D1019596
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: March 26, 2024
    Assignee: SCUD (FUJIAN) ELECTRONICS CO., LTD
    Inventors: Kezhao Liao, Fanghai Xie, Lei Hou, Longqin Wang
  • Patent number: D1022889
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: April 16, 2024
    Assignee: SCUD (FUJIAN) ELECTRONICS CO., LTD.
    Inventors: Kezhao Liao, Fanghai Xie, Lei Hou, Longqin Wang