Abstract: A docker image is received. The docker image is for a container. The container contains files that allow for virtualization of applications that run within the container. The docker image is parsed to identify layer files in the docker image. Installed software components (e.g., installed files) and/or hardware components in the layer files are identified. Software application index calls are made to generate information that identifies relationships between the installed software components and/or hardware components. The relationships between the installed software components and/or hardware components are then displayed to a user.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: A light guide plate adapted to a backlight module is provided. The backlight module has a plurality of point light sources providing a light beam of a predetermined wavelength. The light guide plate includes a light emitting surface, a bottom opposite to the light emitting surface, a light incident surface connecting the light emitting surface and the bottom, a plurality of grating structures, and a plurality of diffusion dots. The light incident surface is near the point light sources. The diffusion dots are disposed on the bottom. At least portions of the grating structures are disposed on the light incident surface. Each of the grating structures has a plurality of concave parts and a plurality of protruding parts. Each of the concave parts is disposed between two neighboring protruding parts. A ratio of the predetermined wavelength to a pitch between two neighboring protruding parts is ranged between 1.2 to 1.3.

Abstract: An optical pickup head and an electromagnetic actuating device thereof are provided. The electromagnetic actuating device is used to move an objective lens carrier having an objective lens assembly to form an optical pickup head. The electromagnetic actuating device includes at least a magnet, at least a coil, and at least a yoke. The magnet is spaced apart from the objective lens carrier by a distance, and the coil is disposed at the objective lens carrier, for generating an electromagnetic force to interact with the magnet. The yoke is spaced apart from the objective lens carrier by a distance, in which the yoke has a protruding part that extends towards the objective lens carrier and is used to attract magnetic flux lines produced by the magnet, and thus making the magnetic flux that passes through the coil be distributed evenly.

Abstract: An optical pickup head and an electromagnetic actuating device thereof are provided. The electromagnetic actuating device is used to move an objective lens carrier having an objective lens assembly to form an optical pickup head. The electromagnetic actuating device includes at least a magnet, at least a coil, and at least a yoke. The magnet is spaced apart from the objective lens carrier by a distance, and the coil is disposed at the objective lens carrier, for generating an electromagnetic force to interact with the magnet. The yoke is spaced apart from the objective lens carrier by a distance, in which the yoke has a protruding part that extends towards the objective lens carrier and is used to attract magnetic flux lines produced by the magnet, and thus making the magnetic flux that passes through the coil be distributed evenly.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.