Abstract: A light guide plate adapted to a backlight module is provided. The backlight module has a plurality of point light sources providing a light beam of a predetermined wavelength. The light guide plate includes a light emitting surface, a bottom opposite to the light emitting surface, a light incident surface connecting the light emitting surface and the bottom, a plurality of grating structures, and a plurality of diffusion dots. The light incident surface is near the point light sources. The diffusion dots are disposed on the bottom. At least portions of the grating structures are disposed on the light incident surface. Each of the grating structures has a plurality of concave parts and a plurality of protruding parts. Each of the concave parts is disposed between two neighboring protruding parts. A ratio of the predetermined wavelength to a pitch between two neighboring protruding parts is ranged between 1.2 to 1.3.

Abstract: An optical pickup head and an electromagnetic actuating device thereof are provided. The electromagnetic actuating device is used to move an objective lens carrier having an objective lens assembly to form an optical pickup head. The electromagnetic actuating device includes at least a magnet, at least a coil, and at least a yoke. The magnet is spaced apart from the objective lens carrier by a distance, and the coil is disposed at the objective lens carrier, for generating an electromagnetic force to interact with the magnet. The yoke is spaced apart from the objective lens carrier by a distance, in which the yoke has a protruding part that extends towards the objective lens carrier and is used to attract magnetic flux lines produced by the magnet, and thus making the magnetic flux that passes through the coil be distributed evenly.

Abstract: An optical pickup head and an electromagnetic actuating device thereof are provided. The electromagnetic actuating device is used to move an objective lens carrier having an objective lens assembly to form an optical pickup head. The electromagnetic actuating device includes at least a magnet, at least a coil, and at least a yoke. The magnet is spaced apart from the objective lens carrier by a distance, and the coil is disposed at the objective lens carrier, for generating an electromagnetic force to interact with the magnet. The yoke is spaced apart from the objective lens carrier by a distance, in which the yoke has a protruding part that extends towards the objective lens carrier and is used to attract magnetic flux lines produced by the magnet, and thus making the magnetic flux that passes through the coil be distributed evenly.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.