Abstract: New MRI coil and resonators are disclosed based solely on superconducting inductive element and built-in capacitive elements as well as hybrid superconducting-metal inductive and capacitive elements having superior SNR. Single and multiple small animal MRI imaging units are also disclosed including one or more resonators of this invention surrounding one or more small animal cavities. Methods for making and using the MRI coils and/or arrays are also disclosed.

Abstract: New MRI coil and resonators are disclosed based solely on superconducting inductive element and built-in capacitive elements as well as hybrid superconducting-metal inductive and capacitive elements having superior SNR. Single and multiple small animal MRI imaging units are also disclosed including one or more resonators of this invention surrounding one or more small animal cavities. Methods for making and using the MRI coils and/or arrays are also disclosed.

Abstract: A light guide plate adapted to a backlight module is provided. The backlight module has a plurality of point light sources providing a light beam of a predetermined wavelength. The light guide plate includes a light emitting surface, a bottom opposite to the light emitting surface, a light incident surface connecting the light emitting surface and the bottom, a plurality of grating structures, and a plurality of diffusion dots. The light incident surface is near the point light sources. The diffusion dots are disposed on the bottom. At least portions of the grating structures are disposed on the light incident surface. Each of the grating structures has a plurality of concave parts and a plurality of protruding parts. Each of the concave parts is disposed between two neighboring protruding parts. A ratio of the predetermined wavelength to a pitch between two neighboring protruding parts is ranged between 1.2 to 1.3.

Abstract: The configurations of an inverter circuit are provided in the present invention. The proposed circuit includes a first bridge arm having a first sub-bridge arm with a first switch and a first middle point coupled to the first switch, and a second sub-bridge arm with a second switch and a second middle point coupled to the second switch, a first inductor having a first terminal coupled to the first middle point and a second terminal, and a second inductor having a first terminal coupled to the second middle point, and a second terminal coupled to the second terminal of the first inductor and outputting an AC voltage.

Abstract: An optical pickup head and an electromagnetic actuating device thereof are provided. The electromagnetic actuating device is used to move an objective lens carrier having an objective lens assembly to form an optical pickup head. The electromagnetic actuating device includes at least a magnet, at least a coil, and at least a yoke. The magnet is spaced apart from the objective lens carrier by a distance, and the coil is disposed at the objective lens carrier, for generating an electromagnetic force to interact with the magnet. The yoke is spaced apart from the objective lens carrier by a distance, in which the yoke has a protruding part that extends towards the objective lens carrier and is used to attract magnetic flux lines produced by the magnet, and thus making the magnetic flux that passes through the coil be distributed evenly.

Abstract: An array of resonators for use in MRI and NMR is disclosed where the resonators are solid state constructs including a pair of resonating elements formed on both sides of a dielectric substrate and cooperate to form a resonator and where each resonator includes at least one discontinuity and the discontinuities on each resonating element are equally spaced and between the resonating elements are equally spaced. A probe for MRI is also disclosed which includes a source of cooling to cool the arrays therein.

Abstract: New MRI coil and resonators are disclosed based solely on superconducting inductive element and built-in capacitive elements as well as hybrid superconducting-metal inductive and capacitive elements having superior SNR. Single and multiple small animal MRI imaging units are also disclosed including one or more resonators of this invention surrounding one or more small animal cavities. Methods for making and using the MRI coils and/or arrays are also disclosed.

Abstract: An optical pickup head and an electromagnetic actuating device thereof are provided. The electromagnetic actuating device is used to move an objective lens carrier having an objective lens assembly to form an optical pickup head. The electromagnetic actuating device includes at least a magnet, at least a coil, and at least a yoke. The magnet is spaced apart from the objective lens carrier by a distance, and the coil is disposed at the objective lens carrier, for generating an electromagnetic force to interact with the magnet. The yoke is spaced apart from the objective lens carrier by a distance, in which the yoke has a protruding part that extends towards the objective lens carrier and is used to attract magnetic flux lines produced by the magnet, and thus making the magnetic flux that passes through the coil be distributed evenly.

Abstract: A DC-AC converter is applicable for transforming direct current (DC) to alternating current (AC). The DC-AC converter includes a voltage boost module and a DC-AC converter module. Herein the voltage boost module includes a voltage bypass circuit and a voltage boost circuit, both of which receive input voltage from DC input power. Meantime, the voltage bypass circuit sends out the received input voltage, and the voltage boost circuit will operate to increase DC output voltage from the DC input as the DC output voltage from the voltage bypass circuit is not high enough to meet requirement by AC output power. The DC-AC converter module receives the output voltage from the voltage boost module and converts the received voltage to the required AC output power.

Abstract: A non-isolated dc/ac converter for converting a dc input source into an ac output source is provided. The converter includes a dc/dc converting module and a dc/ac converting module. The dc/dc converting module includes a voltage shift circuit receiving an input voltage from the dc input source and outputting the input voltage, and a voltage boost circuit boosting an output voltage from the dc/dc converting module when the input voltage from the voltage shift circuit is insufficient for the ac output source. The dc/ac converting module receives the output voltage from the dc/dc converting module and converts the output voltage into the ac output source.

Abstract: A non-isolated dc/ac converter for converting a dc input source into an ac output source is provided. The converter includes a dc/dc converting module and a dc/ac converting module. The dc/dc converting module includes a voltage shift circuit receiving an input voltage from the dc input source and outputting the input voltage, and a voltage boost circuit boosting an output voltage from the dc/dc converting module when the input voltage from the voltage shift circuit is insufficient for the ac output source. The dc/ac converting module receives the output voltage from the dc/dc converting module and converts the output voltage into the ac output source.

Abstract: A DC-AC converter is applicable for transforming direct current (DC) to alternating current (AC). The DC-AC converter includes a voltage boost module and a DC-AC converter module. Herein the voltage boost module includes a voltage bypass circuit and a voltage boost circuit, both of which receive input voltage from DC input power. Meantime, the voltage bypass circuit sends out the received input voltage, and the voltage boost circuit will operate to increase DC output voltage from the DC input as the DC output voltage from the voltage bypass circuit is not high enough to meet requirement by AC output power. The DC-AC converter module receives the output voltage from the voltage boost module and converts the received voltage to the required AC output power.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.