Patents by Inventor Lei R. Li

Lei R. Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10296059
    Abstract: A tool-less heat spreader for dissipating heat produced by an electrical computing component includes a first clamp member having a first component interface end and an opposite, first lever end; and a second clamp member having a second component interface end and an opposite, second lever end; where the first clamp member and the second clamp member are biasedly coupled to one another and such movement of at least one of the first lever end and the second lever end at least partially overcomes the bias and moves the first and second component interface ends away from one another.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: May 21, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron R. Cox, ZhenDe Fu, Lei R. Li, Jason E. Minyard
  • Patent number: 10207854
    Abstract: Transportation packaging may be used to ship or transport a product, such as an electronic device. The transportation packaging may be reused subsequent to the transport of the product by removing a shape defined by a pattern included on the transportation packaging, assembling or altering a portion of the removed pattern, and engaging the assembled pattern with the product. In a particular embodiment, the assembled pattern may provide a usability surface for at least one peripheral device to be used with the electronic device.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: February 19, 2019
    Assignee: International Business Machines Corporation
    Inventors: Aaron R. Cox, ZhenDe Fu, Lei R. Li
  • Patent number: 10031563
    Abstract: A tool-less heat spreader for dissipating heat produced by an electrical computing component includes a first section having a flexible thermal interface material for engaging either side of the electrical computing component; and a rigid heat shield pivotally connected to the first section, the rigid heat shield pivoting between one of a first position and a second position.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: July 24, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron R. Cox, ZhenDe Fu, Lei R. Li, Jason E. Minyard
  • Patent number: 9839140
    Abstract: A method is disclosed for manufacturing an electronic component carrier. The method comprises positioning a header of a frame between opposing attachment arms extending outwardly for attaching an electronic component for seating within the frame. Further, latching members of a latching mechanism of the frame are positioned at a distal end of each of the attachment arms for releaseably seating the electronic component. The attachment arms are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component. Handling levers are positioned for removably mating the electronic component to a connector on a circuit board. The handling levers extend upwardly through an outer casing housing the circuit board when in an open position, and the handling levers are substantially parallel with a top surface of the header when in a closed position.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: December 5, 2017
    Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
    Inventors: Aaron R. Cox, Zhen De Fu, Lei R. Li, Joni E. Saylor
  • Publication number: 20170075393
    Abstract: A tool-less heat spreader for dissipating heat produced by an electrical computing component includes a first clamp member having a first component interface end and an opposite, first lever end; and a second clamp member having a second component interface end and an opposite, second lever end; where the first clamp member and the second clamp member are biasedly coupled to one another and such movement of at least one of the first lever end and the second lever end at least partially overcomes the bias and moves the first and second component interface ends away from one another.
    Type: Application
    Filed: September 14, 2015
    Publication date: March 16, 2017
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron R. COX, ZhenDe FU, Lei R. LI, Jason E. MINYARD
  • Publication number: 20170052573
    Abstract: A tool-less heat spreader for dissipating heat produced by an electrical computing component includes a first section having a flexible thermal interface material for engaging either side of the electrical computing component; and a rigid heat shield pivotally connected to the first section, the rigid heat shield pivoting between one of a first position and a second position.
    Type: Application
    Filed: August 18, 2015
    Publication date: February 23, 2017
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron R. COX, ZhenDe FU, Lei R. LI, Jason E. MINYARD
  • Patent number: 9448597
    Abstract: An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: September 20, 2016
    Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
    Inventors: Aaron R. Cox, Zhen De Fu, Lei R. Li, Jason E. Minyard, Joni E. Saylor
  • Patent number: 9252537
    Abstract: A rotating retention fixture for preventing the undesired removal of an electrical cable from a power strip includes a pronged clip, a first bracket, a second bracket each rotatable about a central axis and a fastener that restricts rotation between the first rotatable bracket and the second rotatable bracket. In order to prevent the undesired removal of the electrical cable from the power strip, the electrical cable may be inserted into the pronged clip, the rotating retention fixture may be positioned such that a bottom surface of the pronged clip is adjacent to the electrical cable, a first bracket and a second bracket of the rotating retention fixture may be rotated about the central axis to contact opposing sides of the power strip, respectively, and the fastener may be engaged to prevent rotation between the first bracket and the second bracket to retain the electrical cable to the power strip.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: February 2, 2016
    Assignee: International Business Machines Corporation
    Inventors: Aaron R. Cox, Zhen De Fu, Lei R. Li, Ming G. Yang
  • Publication number: 20150245498
    Abstract: A method is disclosed for manufacturing an electronic component carrier. The method comprises positioning a header of a frame between opposing attachment arms extending outwardly for attaching an electronic component for seating within the frame. Further, latching members of a latching mechanism of the frame are positioned at a distal end of each of the attachment arms for releaseably seating the electronic component. The attachment arms are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component. Handling levers are positioned for removably mating the electronic component to a connector on a circuit board. The handling levers extend upwardly through an outer casing housing the circuit board when in an open position, and the handling levers are substantially parallel with a top surface of the header when in a closed position.
    Type: Application
    Filed: May 12, 2015
    Publication date: August 27, 2015
    Inventors: Aaron R. Cox, Zhen De Fu, Lei R. Li, Joni E. Saylor
  • Publication number: 20150200489
    Abstract: A rotating retention fixture for preventing the undesired removal of an electrical cable from a power strip includes a pronged clip, a first bracket, a second bracket each rotatable about a central axis and a fastener that restricts rotation between the first rotatable bracket and the second rotatable bracket. In order to prevent the undesired removal of the electrical cable from the power strip, the electrical cable may be inserted into the pronged clip, the rotating retention fixture may be positioned such that a bottom surface of the pronged clip is adjacent to the electrical cable, a first bracket and a second bracket of the rotating retention fixture may be rotated about the central axis to contact opposing sides of the power strip, respectively, and the fastener may be engaged to prevent rotation between the first bracket and the second bracket to retain the electrical cable to the power strip.
    Type: Application
    Filed: January 10, 2014
    Publication date: July 16, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron R. Cox, Zhen De Fu, Lei R. Li, Ming G. Yang
  • Patent number: 9060453
    Abstract: An electronic component carrier and method for mounting the electronic component to a circuit board includes a frame including a header having opposing attachment arms extending outwardly therefrom for seating an electronic component within the frame. A latching mechanism of the frame includes latching members at a distal end of each of the attachment arms for releasably seating the electronic component between the attachment members. The attachment members are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position. Handling levers extend upwardly from the header through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers are substantially parallel with a top surface of the header when in a closed position when the electronic component is mated to the connector.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: June 16, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Aaron R. Cox, Zhen De Fu, Lei R. Li, Joni E. Saylor
  • Publication number: 20150077931
    Abstract: An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Inventors: Aaron R. Cox, Zhen De Fu, Lei R. Li, Jason E. Minyard, Joni E. Saylor
  • Patent number: 8708139
    Abstract: Transportation packaging may be used to ship or transport a product, such as an electronic device. The transportation packaging may be reused subsequent to the transport of the product by removing a shape defined by a pattern included on the transportation packaging, assembling or altering a portion of the removed pattern, and engaging the assembled pattern with the product. In a particular embodiment, the assembled pattern may provide a usability surface for at least one peripheral device to be used with the electronic device.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: April 29, 2014
    Assignee: International Business Machines Corporation
    Inventors: Aaron Roger Cox, ZhenDe Fu, Lei R Li
  • Publication number: 20140091132
    Abstract: Transportation packaging may be used to ship or transport a product, such as an electronic device. The transportation packaging may be reused subsequent to the transport of the product by removing a shape defined by a pattern included on the transportation packaging, assembling or altering a portion of the removed pattern, and engaging the assembled pattern with the product. In a particular embodiment, the assembled pattern may provide a usability surface for at least one peripheral device to be used with the electronic device.
    Type: Application
    Filed: December 3, 2013
    Publication date: April 3, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron R. Cox, ZhenDe Fu, Lei R. Li
  • Publication number: 20120261462
    Abstract: Transportation packaging may be used to ship or transport a product, such as an electronic device. The transportation packaging may be reused subsequent to the transport of the product by removing a shape defined by a pattern included on the transportation packaging, assembling or altering a portion of the removed pattern, and engaging the assembled pattern with the product. In a particular embodiment, the assembled pattern may provide a usability surface for at least one peripheral device to be used with the electronic device.
    Type: Application
    Filed: April 15, 2011
    Publication date: October 18, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron R. Cox, ZhenDe Fu, Lei R. Li