Patents by Inventor Lei-Ya Wang

Lei-Ya Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING DIELECTRIC CERAMIC LAYER AND INTERNAL POLAR LAYER OF MULTIPLE LAYER CERAMIC CAPACITORS (MLCC) BY VACUUM SPUTTERING
    Publication number: 20050251980
    Abstract: A method for manufacturing the dielectric ceramic layer and the internal polar layer of the multiple layer ceramic capacitor by the vacuum sputtering process in which the dielectric ceramic layer and the internal polar layer of the MLCC has a finest thinness of 1˜5 ?m for the dielectric ceramic layer and 0.1˜0.5 ?m for the internal polar layer. Comparing the size and the voltage resistance with the MLCC formed by the traditional dot blade method—both the dry process and the wet process, the MLCC produced by the vacuum sputtering process is finer and thinner; comparing the layer number and the capacitance with the MLCC formed by the tradition dot blade method, the MLCC produced by the vacuum sputtering process has greater layer number and larger capacitance in the same size. When comparing with the layer number and the capacitance, the MLCC formed by the vacuum sputtering process has lesser layers.
    Type: Application
    Filed: May 26, 2004
    Publication date: November 17, 2005
    Inventor: Lei-Ya Wang
  • Method for manufacturing dielectric ceramic layer and internal polar layer of multiple layer ceramic capacitors (MLCC) by vacuum sputtering
    Patent number: 6964087
    Abstract: A method for manufacturing the dielectric ceramic layer and the internal polar layer of the multiple layer ceramic capacitor by the vacuum sputtering process in which the dielectric ceramic layer and the internal polar layer of the MLCC has a finest thinness of 1˜5 ?m for the dielectric ceramic layer and 0.1 ˜0.5 ?m for the internal polar layer. Comparing the size and the voltage resistance with the MLCC formed by the traditional dot blade method—both the dry process and the wet process, the MLCC produced by the vacuum sputtering process is finer and thinner; comparing the layer number and the capacitance with the MLCC formed by the tradition dot blade method, the MLCC produced by the vacuum sputtering process has greater layer number and larger capacitance in the same size. When comparing with the layer number and the capacitance, the MLCC formed by the vacuum sputtering process has lesser layers.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: November 15, 2005
    Inventor: Lei-Ya Wang