Abstract: The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly recessed in a carrier in the printed board. The chips is placed over the temperature-compensated device.The temperature-compensated device includes a piece of metal recessed in the carrier under the chip. A layer of copper is fixed against the upper side of the carrier and the upper side of the metal piece. The thickness of the copper layer and the thickness of the metal piece are dimensioned so that the resulting coefficient of linear expansion at the upper side of the copper layer is equally big as or a bit bigger than the coefficient of linear expansion of the chip.The temperature-compensated device can as an alternative to the above include a module recessed in the carrier under the chip.