Abstract: The present invention relates to a distance retaining dielectric material applied between layers of a conductive material, so as to enable the distance between said layers to be minimized to a given permitted minimum distance. This is achieved by providing the dielectric material, e.g. a glue film, with a low concentration of non-conductive particles that hold the layers at a minimum distance apart corresponding to the diameter of the particles.

Abstract: The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area (10) of the printed board (11). A separate component (1) for signal transmission comprises a conductor (5). The component (1) is mounted, with the conductor facing the printed board (11), over the area (10) of the printd board, which requires good transmissions qualities, whereby an air gap (L) is obtained between the conductor (5) and the printed board (11). Soldering joints (21) connect each one of the outer parts (7a, 7b) of the conductor (5) of the component (1) to corresponding pattern conductors (17a, 17b) on the printed board (11). The thickness of the soldering connections and the thickness of the pattern conductors form the air gap (L) be the conductor (5) and the printed board (11).

Abstract: The present invention relates to a solder stop in through-plated through-holes on micro strip boards (8). A solder resist lacquer (18) with a certain viscosity is applied on a micro strip board (8) wherein the solder resist lacquer (18) flows out over the micro strip (8) and down into a top portion of the through-plated through-hole and dried. A ring-shaped portion of the solder resist lacquer (18) is retained in the top part of the through-plated through-hole.