Abstract: A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate.

Abstract: A MEMS microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of a backplate from an acoustically inactive section of the backplate.

Abstract: The present invention concerns a MEMS device comprising an under bump metallization (4)—UBM—to contact the device via flip-chip bonding with a substrate. The UBM (4) is placed on the surface of the MEMS device and close to the corners of the surface. Further, the shape of the UBM (4) is adapted to the shape of the corners.

Abstract: A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. The MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area.

Abstract: A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate.

Abstract: A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. A MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area.

Abstract: A MEMS microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of the backplate from an acoustically inactive section of the backplate.

Abstract: The present invention concerns a MEMS device comprising an under bump metallization (4)—UBM—to contact the device via flip-chip bonding with a substrate. The UBM (4) is placed on the surface of the MEMS device and close to the corners of the surface. Further, the shape of the UBM (4) is adapted to the shape of the corners.

Abstract: A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.

Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.

Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.

Abstract: A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.