Patents by Inventor Leijie ZHOU

Leijie ZHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250013280
    Abstract: A PMIC controls multiple power supply circuits. Nonvolatile memory supports repeated writing and has multiple pages. A memory control circuit selects one from among the multiple pages of the nonvolatile memory and writes internal data that indicates an internal state of the power supply management circuit to the write target page. The memory control circuit selects an already-erased page as the write target page and writes the internal data to it, and erases pages other than the write target page.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 9, 2025
    Inventors: Leijie ZHOU, Hirofumi INADA
  • Patent number: 9357678
    Abstract: A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: May 31, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Leijie Zhou, Hiroyuki Okabe
  • Publication number: 20130342999
    Abstract: A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink.
    Type: Application
    Filed: March 4, 2013
    Publication date: December 26, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Leijie ZHOU, Hiroyuki OKABE