Patents by Inventor Leisa A. Ryan

Leisa A. Ryan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low application temperature hot melt adhesive
    Patent number: 7795336
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: September 14, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Low application temperature hot melt adhesive
    Patent number: 7683114
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: March 23, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Multi-layer film packaging of hot melt adhesive
    Patent number: 7350644
    Abstract: Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: April 1, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Michael G. Harwell, Dale L. Haner, Leisa A. Ryan
  • Low application temperature hot melt adhesive
    Publication number: 20040077240
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Application
    Filed: October 18, 2002
    Publication date: April 22, 2004
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Multi-layer film for hot melt packaging
    Publication number: 20040074800
    Abstract: Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Inventors: Michael G. Harwell, Dale L. Haner, Leisa A. Ryan