Patents by Inventor Leiwen Li

Leiwen Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8662942
    Abstract: A method for manufacturing a Universal Serial Bus (USB) head comprises: locating metal sheets with both ends being closed into a first mold and performing a first injection molding; removing a sprue portion and a fixing portion at top of the metal sheets from a product subjected to the first injection molding, to obtain a first-injected-product; locating the first-injected-product into a second mold and performing a second injection molding; removing an exposed fixing portion of the metal sheets from a second-injected-product, to obtain the USB head desired. In the USB head, four metal sheets are arranged with a certain spacing, and the metal sheets are closed at both ends.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: March 4, 2014
    Assignee: ZTE Corporation
    Inventor: Leiwen Li
  • Publication number: 20120295497
    Abstract: A method for manufacturing a Universal Serial Bus (USB) head comprises: locating metal sheets with both ends being closed into a first mould and performing a first injection molding; removing a sprue portion and a fixing portion at top of the metal sheets from a product subjected to the first injection molding, to obtain a first-injected-product; locating the first-injected-product into a second mould and performing a second injection molding; removing an exposed fixing portion of the metal sheets from a second-injected-product, to obtain the USB head desired. In the USB head, four metal sheets are arranged with a certain spacing, and the metal sheets are closed at both ends.
    Type: Application
    Filed: October 26, 2010
    Publication date: November 22, 2012
    Applicant: ZTE CORPORATION
    Inventor: Leiwen Li