Patents by Inventor Lejun Qi

Lejun Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11657973
    Abstract: A wet capacitor is provided, and the use of an insulation fluid composition in such a capacitor. The capacitor includes a package of a metal foil and a polymeric insulating film, or of a metallized polymeric film, wherein the insulation composition includes a synthetic or natural aromatic oil and a polymer. The insulation composition is configured to undergo a thermo-reversible oil-to-gel transition at a predefined gel-point temperature. Further, methods of producing such wet capacitors are provided, optionally including additional filling materials, and methods of sealing leaks in such capacitors.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: May 23, 2023
    Assignee: Hitachi Energy Switzerland AG
    Inventors: LeJun Qi, Saskia Scheel, Emmanuel Logakis, Felix Bandalo, Richard-changyu Zhang, Biswajit Singh
  • Patent number: 11569036
    Abstract: A dielectric film is provided. The dielectric film includes a dielectric polymer substrate having two surfaces opposite to each other and a coating layer formed on at least one of the two surfaces of the dielectric polymer substrate by chemical vapor deposition polymerization and/or irradiation polymerization. A power capacitor includes the dielectric film. A process for preparing the dielectric film is provided.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: January 31, 2023
    Assignee: HITACHI ENERGY SWITZERLAND AG
    Inventors: Lejun Qi, Chau-Hon Ho, Linnea Petersson, Jiansheng Chen
  • Patent number: 11264169
    Abstract: A capacitor insulation system is disclosed in the present application. The insulation system includes a dielectric fluid containing a first voltage stabilizing additive of a first concentration. The insulation system further includes a dielectric film containing the first voltage stabilizing additive of a second concentration and impregnated in the dielectric fluid. The first concentration is greater than the second concentration. The insulation system prepared according to the present disclosure can provide an increased and quite stable dielectric strength.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 1, 2022
    Assignee: Hitachi Energy Switzerland AG
    Inventors: Lejun Qi, Yang Wang, Nan Li, Yu Guan, Jiansheng Chen
  • Publication number: 20210193388
    Abstract: A dielectric film is provided. The dielectric film includes a dielectric polymer substrate having two surfaces opposite to each other and a coating layer formed on at least one of the two surfaces of the dielectric polymer substrate by chemical vapor deposition polymerization and/or irradiation polymerization. A power capacitor includes the dielectric film. A process for preparing the dielectric film is provided.
    Type: Application
    Filed: October 9, 2017
    Publication date: June 24, 2021
    Applicant: ABB Power Grids Switzerland AG
    Inventors: Lejun QI, Chau-Hon HO, Linnea PETERSSON, Jiansheng CHEN
  • Publication number: 20210043381
    Abstract: A wet capacitor is provided, and the use of an insulation fluid composition in such a capacitor. The capacitor includes a package of a metal foil and a polymeric insulating film, or of a metallized polymeric film, wherein the insulation composition includes a synthetic or natural aromatic oil and a polymer. The insulation composition is configured to undergo a thermo-reversible oil-to-gel transition at a predefined gel-point temperature. Further, methods of producing such wet capacitors are provided, optionally including additional filling materials, and methods of sealing leaks in such capacitors.
    Type: Application
    Filed: March 11, 2019
    Publication date: February 11, 2021
    Applicant: ABB Power Grids Switzerland AG
    Inventors: LeJun QI, Saskia SCHEEL, Emmanuel LOGAKIS, Felix BANDALO, Richard-changyu ZHANG, Biswajit SINGH
  • Publication number: 20190311855
    Abstract: A capacitor insulation system is disclosed in the present application. The insulation system includes a dielectric fluid containing a first voltage stabilizing additive of a first concentration. The insulation system further includes a dielectric film containing the first voltage stabilizing additive of a second concentration and impregnated in the dielectric fluid. The first concentration is greater than the second concentration. The insulation system prepared according to the present disclosure can provide an increased and quite stable dielectric strength.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 10, 2019
    Inventors: Lejun Qi, Yang Wang, Nan Li, Yu Guan, Jiansheng Chen
  • Patent number: 10115522
    Abstract: A multi-layered dielectric polymer material, a capacitor comprising the multi-layered dielectric polymer material, a use of the multi-layered dielectric polymer material and a method for forming the multi-layered dielectric polymer material are disclosed. The multi-layered dielectric polymer material may comprise a plurality of dielectric layers wherein the plurality of dielectric layers may comprise an identical base material. The base material may be compound with agents for at least one of the plurality of dielectric layers. It may overcome compatible issues for convention multi-layered material. The dielectric polymer material may have increased dielectric strength and excellent thermal properties.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: October 30, 2018
    Assignee: ABB Schweiz AG
    Inventors: Lejun Qi, Nan Li, Delun Meng, Sari Laihonen, Francois Delince
  • Patent number: 9834671
    Abstract: A curable epoxy resin composition including: (a) a cycloaliphatic epoxy resin, (b) an oxazolidone ring-containing epoxy resin, (c) a reaction product of (i) an anhydride compound and (ii) a polyol, and (d) an anhydride hardener; a process for preparing the curable epoxy resin composition; and a composite including a reinforcing fiber embedded in a thermoset resin, wherein the thermoset resin is a reaction product of the curable epoxy resin composition.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: December 5, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Yanli Feng, Lejun Qi, Yi Zhang, Wei Du
  • Publication number: 20160276105
    Abstract: A multi-layered dielectric polymer material, a capacitor comprising the multi-layered dielectric polymer material, a use of the multi-layered dielectric polymer material and a method for forming the multi-layered dielectric polymer material are disclosed. The multi-layered dielectric polymer material may comprise a plurality of dielectric layers wherein the plurality of dielectric layers may comprise an identical base material. The base material may be compound with agents for at least one of the plurality of dielectric layers. It may overcome compatible issues for convention multi-layered material. The dielectric polymer material may have increased dielectric strength and excellent thermal properties.
    Type: Application
    Filed: May 26, 2016
    Publication date: September 22, 2016
    Inventors: Lejun Qi, Nan Li, Delun Meng, Sari Laihonen, Francois Delince
  • Publication number: 20150284562
    Abstract: A curable epoxy resin composition including: (a) a cycloaliphatic epoxy resin, (b) an oxazolidone ring-containing epoxy resin, (c) a reaction product of (i) an anhydride compound and (ii) a polyol, and (d) an anhydride hardener; a process for preparing the curable epoxy resin composition; and a composite including a reinforcing fiber embedded in a thermoset resin, wherein the thermoset resin is a reaction product of the curable epoxy resin composition.
    Type: Application
    Filed: November 7, 2012
    Publication date: October 8, 2015
    Applicants: The Dow Chemical Company, Dow Chemical (China) Investment Company Limited
    Inventors: Yanli Feng, Lejun Qi, Yi Zhang, Wei Du
  • Publication number: 20150210846
    Abstract: A curable epoxy resin composition containing (a) from 60 to 85 weight percent of a cycloaliphatic epoxy resin, (b) from 15 to 40 weight percent of an oxazolidone ring containing epoxy resin, (c) at least one anhydride hardener, and (d) at least one toughening agent, where weight percent values are relative to total weight of epoxy resins in the curable epoxy resin composition; a process for preparing the curable epoxy resin composition; a composite containing a continuous reinforcing fiber embedded in a reaction product of the curable epoxy resin composition and a cable comprising the composite as a core.
    Type: Application
    Filed: April 27, 2012
    Publication date: July 30, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Lejun Qi, Wei Du, Yi Zhang