Patents by Inventor Leke Li

Leke Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating pin structure for mitigation of LED temperature rise
    Patent number: 7227750
    Abstract: A heat-dissipating pin structure for mitigation of LED temperature rise, characterized in that: on metallic foil circuit or foil surfaced of PCB connecting to joining surface of LED chip, on which LED chips or light-emitting diodes of surface-mounting type or light-emitting single tube will be installed, are provided a plurality of small perpendicular through holes, in which are inserted loose-fitted and heat-conductive pins, and ends of these pins are adapted to be riveted perpendicularly or brazed directly to PCB, so that pins inserted in these holes can be fixed vertically on the back surface of PCB.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: June 5, 2007
    Assignee: Shanghai Sansi Technology Co. Ltd.
    Inventors: Bishou Chen, Sheng Li, Leke Li
  • Heat dissipating pin structure for mitigation of LED temperature rise
    Publication number: 20050195566
    Abstract: A heat-dissipating pin structure for mitigation of LED temperature rise, characterized in that: on metallic foil circuit or foil surfaced of PCB connecting to joining surface of LED chip, on which LED chips or light-emitting diodes of surface-mounting type or light-emitting single tube will be installed, are provided a plurality of small perpendicular through holes, in which are inserted loose-fitted and heat-conductive pins, and ends of these pins are adapted to be riveted perpendicularly or brazed directly to PCB, so that pins inserted in these holes can be fixed vertically on the back surface of PCB.
    Type: Application
    Filed: February 11, 2005
    Publication date: September 8, 2005
    Inventors: Bishou Chen, Sheng Li, Leke Li