Patents by Inventor Lekhanh Dang

Lekhanh Dang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
    Patent number: 7360307
    Abstract: A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: April 22, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: Zhiping Yang, Vinayagam Arumugham, Lekhanh Dang
  • Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
    Publication number: 20060073641
    Abstract: A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.
    Type: Application
    Filed: November 18, 2005
    Publication date: April 6, 2006
    Inventors: Zhiping Yang, Vinayagam Arumugham, Lekhanh Dang
  • Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
    Patent number: 6992374
    Abstract: A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: January 31, 2006
    Assignee: Cisco Technology, Inc.
    Inventors: Zhiping Yang, Vinayagam Arumugham, Lekhanh Dang