Abstract: A sensor assembly comprises a base plate and a sensor member displaceable relative to the base plate. A spring arrangement operates in first and second stages in response to displacement of the sensor member relative to the base plate. Different resolutions of force and torque measurements are associated with the first and second stages. A light sensitive transducer senses displacement of the sensor member relative to the base plate and generates corresponding output signals. A collimator directs a plurality of light beams onto the light sensitive transducer so that the light beams strike different pixels of the light sensitive transducer to sense displacement of the sensor member relative to the base plate.

Abstract: A sensor assembly comprises a base plate and a sensor member displaceable relative to the base plate. A spring arrangement operates in first and second stages in response to displacement of the sensor member relative to the base plate. Different resolutions of force and torque measurements are associated with the first and second stages. A light sensitive transducer senses displacement of the sensor member relative to the base plate and generates corresponding output signals. A collimator directs a plurality of light beams onto the light sensitive transducer so that the light beams strike different pixels of the light sensitive transducer to sense displacement of the sensor member relative to the base plate.

Abstract: A sensor assembly comprises a base plate and a sensor member displaceable relative to the base plate. A spring arrangement operates in first and second stages in response to displacement of the sensor member relative to the base plate. Different resolutions of force and torque measurements are associated with the first and second stages. A light sensitive transducer senses displacement of the sensor member relative to the base plate and generates corresponding output signals. A collimator directs a plurality of light beams onto the light sensitive transducer so that the light beams strike different pixels of the light sensitive transducer to sense displacement of the sensor member relative to the base plate.

Abstract: A device includes a semiconductor substrate having a plurality of doped layers forming first and second junctions. The semiconductor substrate includes a first surface and a second surface opposite the first surface. The device includes a plurality of waveguides defined by a plurality of glass inlaid channels defined within the first surface. Each of the plurality of glass inlaid channels extends through the second junction. The device includes a pattern of reflective elements associated with sidewalls of the plurality of glass inlaid channels to reflect light into the plurality of waveguides. A first electrically-conductive layer is disposed on the first surface and covers the plurality of glass inlaid channels.

Abstract: A sensor assembly comprises a base plate and a sensor member displaceable relative to the base plate. A spring arrangement operates in first and second stages in response to displacement of the sensor member relative to the base plate. Different resolutions of force and torque measurements are associated with the first and second stages. A light sensitive transducer senses displacement of the sensor member relative to the base plate and generates corresponding output signals. A collimator directs a plurality of light beams onto the light sensitive transducer so that the light beams strike different pixels of the light sensitive transducer to sense displacement of the sensor member relative to the base plate.

Abstract: A micro-machined accelerometer includes a moveable metal plate, mounted upon a semiconductor substrate. The moveable metal plate includes an aperture which contains a pedestal and at least one torsion bar for connecting the pedestal to the moveable metal plate. Measurement electrodes formed on the semiconductor substrate combine with the metal plate to form measurement capacitors. A combined self-test/common electrode provides a dual function of a common electrode during operation of the accelerometer and a testing electrode during a self-test procedure.

Abstract: A single-point impact sensor has a fully differential capacitive sense element for providing a capacitive difference which is proportional to the acceleration of the vehicle. The capacitive difference is converted into a digital pulse train signal which is pulse density modulated with variations in the capacitance. The pulse density of the pulse train is evaluated according to a hierarchy of counters and timers to determine if it is indicative of an activation worthy event. In one embodiment, a non-volatile programmable memory is provided to control the operation of the impact sensor.

Abstract: A method and apparatus for detecting faults in a single-point impact sensing system having electrically conductive self-test plates within the sensor to electrostatically deflect the sense element during self-test sequence. The deflection of the sense element is identical to deflection which would occur during an actual activation worthy impact event. The response time from the deflection of the sense element to the change in state of an activation flag is recorded and compared with an expected response time stored in non-volatile memory. Differences between the test time and the expected time is indicative of either a hard fault such as malfunction or reduced function of sensing system components or soft faults such as loss of calibration. Diagnostic self-test in this manner not only checks the electrical continuity of the impact sensing system, but also the mechanical integrity and the calibration of the sensing system.

Abstract: A sense element is provided which has a boron doped silicon body positioned above and parallel to a substrate with a plurality of openings extending through the semiconductive body, the plurality of openings producing a damping such that the natural frequency and the measurement bandwidth of the sense element are modified.

Abstract: Integrated semiconductor-on-insulator (SOI) sensors and circuits which are electrostatically bonded to a support substrate, such as glass or an oxidized silicon wafer, are disclosed. The SOI sensors and SOI circuits are both formed using a novel fabrication process which allows multiple preformed and pretested integrated circuits on a silicon wafer to be electrostatically bonded to the support substrate without exposing the sensitive active regions of the electronic devices therein to a damaging electric field. The process includes forming a composite bonding structure on top of the integrated circuits prior to the bonding step. This composite structure includes a conductive layer dielectrically isolated from the circuit devices and electrically connected to the silicon wafer, which is spaced form but laterally overlaps at least the active semiconductive regions of the circuit devices.

Abstract: A method for calibrating an impact sensor enables calibration to take place after sensor manufacture is completed. During calibration, the sensor undergoes an acceleration while vehicle specific calibration values are programmed into sensor memory for different incremental rates of acceleration. Calibration verification checks to verify that the relationship between acceleration and sensor output is linear. The calibration also includes a hysteresis test by comparing output values when incrementally increasing the acceleration to corresponding acceleration values while incrementally decreasing acceleration. The calibration method may also include calculating a response time for a self-test circuit that can be stored in memory and later used during self-tests of the sensor.