Abstract: In one embodiment, the disclosure relates to an electro-optical device that includes an optical gain chip that includes; a gain material, the gain material having a gain region, the optical gain chip that includes: N gain chip waveguides; a photonic integrated circuit (PIC) that includes a plurality of layers and a plurality of components, wherein the PIC defines M sections; N external laser cavities; P PIC waveguides; and B distributed Bragg reflector (DBR) rings, wherein each of the N external laser cavities is defined by one of the P PIC waveguides and one of the B DBR rings; and N laser cavities, wherein each laser cavity of the N laser cavities comprises one of the N external laser cavities and one of the N gain chip waveguides.

Abstract: Described is a thermally stabilized sensor for cooled component packages. A cooled component package includes a cooled component, a temperature-sensing device located adjacent to the cooled component, and a heat flow modifier located adjacent to the temperature-sensing device. Examples of the heat flow modifier include a ground shield, a wire bonded to platform upon which the cooled component is mounted, and a bonding layer between a refrigerator element and an optical subassembly that includes the cooled component.