Abstract: High density integrated circuits and more particularly to a high density integrated circuit incorporating a multiplicity of functional chips arranged on a substrate comprised of a plurality of dielectric and conductive layers which interface the semiconductor dies with a ball gate array (BGA) arranged on the underside of the substrate and wherein the main heat generating areas of the semiconductor dies are directly coupled to selected balls of the BGA for directly carrying heat from the major heat sources away from the device.

Abstract: Method and apparatus for interconnecting cards carrying heat generating ICs. A heat sink having a plurality of heat tubes is placed between two cards. The ICs are mounted “face down” so that the heat sink engages surfaces of the ICs opposite the surfaces having electrical and heat conductive terminals wherein an interstitial layer of a non-conducting, preferably gel-like material is placed between the heat sink and the surfaces of the ICs to alleviate mechanical stresses and enhance heat transfer. The thickness of the cards made of multiple conductive layers, separated by dielectric layers are controlled to provide cards of the same thickness. The heat sink provides proper spacing between and parallelism of facing surfaces of the cards to assure reliable connection and signal integrity between high speed connectors arranged on facing surfaces of the cards to electrically connect components from one board to the other.

Abstract: A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.

Abstract: A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.