Abstract: Methods and apparatuses are disclosed for defining a locus of viable points on an elongated object, such as a locus of viable bond points on a lead of a lead frame. The locus guides the bond point positioning of a wire bonder so that the number of unacceptable wire bonds is reduced. The locus is a region adapted to receive a bond, and is defined such that for any bond centered therein, the probability of forming an unacceptable bond is reduced by offsetting the locus from at least a portion of the lead edge(s) by a minimum-offset distance. The minimum-offset distance is based on various factor(s), such as user tolerance and bond width. Further, the definition of the locus is independent of lead shape, and consequently works with a variety of lead shapes. The locus can also have various shapes for a single lead, and the shapes can vary depending on the application.