Patents by Inventor Lendon L. Bendix

Lendon L. Bendix has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11056089
    Abstract: A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact is connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 ?m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 6, 2021
    Assignee: Sparton DeLeon Springs, LLC
    Inventor: Lendon L. Bendix
  • Publication number: 20210204396
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Application
    Filed: March 8, 2021
    Publication date: July 1, 2021
    Applicant: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 10973140
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 6, 2021
    Assignee: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Publication number: 20200098344
    Abstract: A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 ?m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 26, 2020
    Applicant: Sparton Corporation
    Inventor: Lendon L. Bendix
  • Publication number: 20190364684
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Applicant: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 10420239
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: September 17, 2019
    Assignee: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Publication number: 20180338382
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Application
    Filed: July 27, 2018
    Publication date: November 22, 2018
    Applicant: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 10070547
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: September 4, 2018
    Assignee: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Publication number: 20160316553
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a transconductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Application
    Filed: July 6, 2016
    Publication date: October 27, 2016
    Applicant: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Publication number: 20150245548
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The PCBA has one or more designated protected areas. An electrical current with a predetermined current density is present in the conductive layer when the PCBA is placed in the electric field. The TCL is constructed of a nickel-metal composite metamaterial positioned between the conductive and dielectric layers. The TCL has a variable geometry with respect to at least one of the thickness, width, and length of the PCBA, and compresses in proportion to an energy level of the electric field to direct the electrical current away from the designated protected area(s). A system includes a housing, a power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 27, 2015
    Applicant: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 8763240
    Abstract: A fabricating process for a multi-layer printed circuit board containing embedded passive components is provided. The method includes a calibration step wherein a calibration measurement is taken of the geometry or at least one electrical parameter of an arrangement of calibration test points for a circuit forming process, such as masking, etching and/or lamination. A process control step is performed during the process, wherein a process control measurement is taken of at least one electrical parameter at one or more process control test points along one or more axes outside areas in which a circuit is to be formed. An analysis is performed of at least the calibration measurement and the process control measurement to calculate a CAD geometry change required to improve precision of embedded passive components to be printed on the multi-layer printed circuit board.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: July 1, 2014
    Assignee: TFRI, Inc.
    Inventors: Lendon L. Bendix, Derek A. Turner
  • Patent number: 8427652
    Abstract: Systems (200) and methods (300) for measuring geometric changes of a passive material (414) when heat and pressure are applied thereto. The methods involve forming a pad (108, 510) on a passive material panel (410). The pad includes at least one of a layer of a passive material (414) and a layer of a metal (416). The methods also involve coupling an interferometer (810) to the pad. The method also involves forming a multi-layer structure by placing at least one substrate panel (400) on top of the passive material such that an aperture (602) formed in the substrate panel is aligned with the pad. Pressure and heat are applied to the multi-layer structure. Data is collected using the interferometer while the pressure and heat are applied to the multi-layer structure. The interferometer can include, but is not limited to, a Fabry-Perot interferometer, a Michelson interferometer and/or a Mach-Zehnder interferometer.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: April 23, 2013
    Assignee: Harris Corporation
    Inventors: Lendon L. Bendix, Barry G. Grossman, Mathew M. Kincaid, Jon Tower
  • Publication number: 20120000064
    Abstract: A fabricating process for a multi-layer printed circuit board containing embedded passive components is provided. The method includes a calibration step wherein a calibration measurement is taken of the geometry or at least one electrical parameter of an arrangement of calibration test points for a circuit forming process, such as masking, etching and/or lamination. A process control step is performed during the process, wherein a process control measurement is taken of at least one electrical parameter at one or more process control test points along one or more axes outside areas in which a circuit is to be formed. An analysis is performed of at least the calibration measurement and the process control measurement to calculate a CAD geometry change required to improve precision of embedded passive components to be printed on the multi-layer printed circuit board.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 5, 2012
    Applicant: TFRI, INC.
    Inventors: Lendon L. Bendix, Derek A. Turner
  • Publication number: 20110164256
    Abstract: Systems (200) and methods (300) for measuring geometric changes of a passive material (414) when heat and pressure are applied thereto. The methods involve forming a pad (108, 510) on a passive material panel (410). The pad includes at least one of a layer of a passive material (414) and a layer of a metal (416). The methods also involve coupling an interferometer (810) to the pad. The method also involves forming a multi-layer structure by placing at least one substrate panel (400) on top of the passive material such that an aperture (602) formed in the substrate panel is aligned with the pad. Pressure and heat are applied to the multi-layer structure. Data is collected using the interferometer while the pressure and heat are applied to the multi-layer structure. The interferometer can include, but is not limited to, a Fabry-Perot interferometer, a Michelson interferometer and/or a Mach-Zehnder interferometer.
    Type: Application
    Filed: January 7, 2010
    Publication date: July 7, 2011
    Applicant: Harris Corporation
    Inventors: Lendon L. Bendix, Barry G. Grossman, Mathew M. Kincaid, Jon Tower
  • Publication number: 20100024210
    Abstract: A method is provided for manufacturing a multi-layer circuit board having embedded passive components. The method includes selectively removing portions of at least one layer of the multi-layer circuit board (300) to form a two dimensional array of test points (304) defining a grid extending across a surface of the multi-layer circuit board in those areas on which a circuit is to be formed. The method also includes measuring at each of the test points at least one electrical parameter which is useful for defining a characteristic of the multi-layer circuit board. The method further includes selectively modifying the geometry of at least one embedded passive component to be formed on the multi-layer circuit board based on an analysis of a result obtained in the measuring step.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 4, 2010
    Applicant: HARRIS CORPORATION
    Inventor: Lendon L. Bendix