Abstract: Methods, sorbent cartridges and cleaning devices are disclosed for refurbishing sorbent materials. In one implementation among multiple implementations, a medical fluid delivery method includes: providing a sorbent cartridge including H+ZP within a casing for a treatment; and after the treatment, refurbishing the H+ZP while maintained within the casing via (i) regenerating the non-disinfected H+ZP by flowing an acid solution through the casing, (ii) rinsing the regenerated H+ZP while maintained within the casing, (iii) disinfecting the regenerated and rinsed H+ZP by flowing a disinfecting agent through the casing, and (iv) rinsing the regenerated and disinfected H+ZP while maintained within the casing. Multiple batch sorbent refubishing implementations are also disclosed.

Abstract: A gravity fed peritoneal dialysis (“PD”) machine includes: a frame configured to be set on a supporting surface; at least one load cell; a scale platform supported by the frame via the at least one load cell positioned between the frame and the scale platform; a drain container support in mechanical communication with and extending downwardly from the scale platform, the machine configured such that when the frame is set on the supporting surface, at least one fresh PD fluid supply container is supportable by the scale platform above the at least one load cell and at least one used PD fluid drain container is supportable by the drain container support below the at least one load cell, so that a combined weight of fresh PD fluid and used PD fluid may be sensed by the at least one load cell.

Abstract: A method of bonding at least two substrates, each substrate having at least one surface that includes a layer of SU8, said method comprising soft baking at least a portion of the layer of SU8 of the first and second substrates, exposing at least the portion of the layer of SU8 of the first and second substrates to ultraviolet (UV) radiation to cross-link at least the portion of the layer of SU8 of the second substrate to a suitable degree, post exposure baking at least the portion of the layer of SU8 of the first substrate at a temperature greater than or equal to 20 degree Celsius (° C.) and less than or equal to 50 degree Celsius (° C.) to cross-link at least the portion of the layer of SU8 of the first substrate to a suitable degree. The method also includes compressing the portion of the cross-linked layer of SU8 of the first substrate against the portion of the cross-linked layer of SU8 of the second substrate at a suitable starting temperature (Ts) for a suitable time period (tcomp).