Patents by Inventor Leng See

Leng See has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and substrate to control flow of underfill
    Publication number: 20050121310
    Abstract: A selective sputtering method and resulting substrate are provided. This may involve obtaining a substrate and identifying a die placement area and a keep out area of the substrate. A protective area may be formed over the substrate between the die placement area and the keep out area. This may be done using a selective sputtering process. Underfill material may be provided over at least the die placement area of the substrate without the underfill material flowing to the keep out area based on the surface roughness of the keep out area.
    Type: Application
    Filed: December 3, 2003
    Publication date: June 9, 2005
    Inventors: Atsushi Yamada, Hideki Goto, Dennis Chandran, Leng See, Heng Lee