Patents by Inventor Lenny E. Lay

Lenny E. Lay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive-bonded attachment device
    Patent number: 10352345
    Abstract: An adhesive-bonded attachment device includes a mounting base including a mounting surface, a structural adhesive disposed on the mounting surface, and a pressure-sensitive adhesive disposed on the mounting surface bordering the structural adhesive, wherein the structural adhesive and the pressure-sensitive adhesive define a bonding surface configured to be bonded to a contact surface of a structure, and an attachment feature disposed on said mounting base.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: July 16, 2019
    Assignee: The Boeing Company
    Inventors: Nick S. Evans, Lenny E. Lay
  • Adhesive-Bonded Attachment Device
    Publication number: 20180154583
    Abstract: An adhesive-bonded attachment device includes a mounting base including a mounting surface, a structural adhesive disposed on the mounting surface, and a pressure-sensitive adhesive disposed on the mounting surface bordering the structural adhesive, wherein the structural adhesive and the pressure-sensitive adhesive define a bonding surface configured to be bonded to a contact surface of a structure, and an attachment feature disposed on said mounting base.
    Type: Application
    Filed: December 5, 2016
    Publication date: June 7, 2018
    Applicant: The Boeing Company
    Inventors: Nick S. Evans, Lenny E. Lay
  • Wire bundle support system
    Patent number: 7654492
    Abstract: A support system for an elongate object comprising an elongate support bar, a tower member, and a stackable riser for securing the elongate object to the tower member.
    Type: Grant
    Filed: May 3, 2004
    Date of Patent: February 2, 2010
    Assignee: The Boeing Company
    Inventors: Mark Balderama, Thomas A. Holum, Lenny E. Lay