Abstract: A testing paddle for a semiconductor package includes a land that is electrically and/or communicatively coupled to a test point of a device under test (DUT) die. The land is associated with a spacing characteristic that is larger than a spacing characteristic associated with the test point. As such, during a characterization process, a probe can more easily access the land of the testing paddle when compared with current solutions in which the probe is required to contact the test point of the DUT die.

Abstract: An adapter as disclosed herein includes at least one transmission path providing an electrical connection between the probing end and the head connection end. The adapter includes a flexible tab-board adapter associated with the probing end of the transmission path, the flexible tab-board adapter for contacting at least one signal testing point. The adapter may further include at least one compensating network positioned substantially near the probing end, the at least one compensating network configured to compensate for parasitics of the adapter.