Abstract: A method and apparatus for achieving monochromatic response from a low-cost color imager are presented. In this method and apparatus, the out-of-band response to infrared (IR) light by solid state sensors is exploited to produce a monochrome image. The monochrome image is produced by omitting the IR blocking filter from the sensor of the color imager and illuminating the scene to be imaged including IR radiation from an LED. The wavelength emitted from the LED is matched to the wavelength or wavelengths that correspond to a region where the sensor's response to IR light is relatively even, despite the color-mosaic filter permanently attached to the sensor.

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract: Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light.

Abstract: Systems and methods are provided for imaging a planar specular object such as a semiconductor wafer. In one embodiment, an imaging system for imaging a defect on a planar specular object includes a telecentric lens having a sufficiently aspherical surface such that the telecentric lens is substantially corrected for an optical aberration. The imaging system also includes a telecentric stop including an aperture therein to block light reflected from the planar specular object while allowing light reflected from the defect to pass through the aperture. The imaging system further includes a lens group having a system stop positioned between the telecentric stop and the lens group. The lens group is substantially corrected for the optical aberration independent of the telecentric lens.

Abstract: Systems and methods are provided for imaging a planar specular object such as a semiconductor wafer. In one embodiment, an imaging system for imaging a defect on a planar specular object includes a telecentric lens having a sufficiently aspherical surface such that the telecentric lens is substantially corrected for an optical aberration. The imaging system also includes a telecentric stop including an aperture therein to block light reflected from the planar specular object while allowing light reflected from the defect to pass through the aperture. The imaging system further includes a lens group having a system stop positioned between the telecentric stop and the lens group. The lens group is substantially corrected for the optical aberration independent of the telecentric lens.

Abstract: Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light.

Abstract: A method and apparatus is presented for laser machining complex features in workpieces using programmable laser focal spot shapes. A deformable mirror is inserted into the laser beam path of a laser machining system and programmed to alter the shape of the laser beam focal spot in real time as the workpiece is being laser machined in order to achieve improved control over the shape and size of laser machined features.

Abstract: Embodiments of the present invention employ certain techniques, alone or in combination, to enhance a range of acceptance angles at which an apparatus may efficiently collect solar radiation. One technique positions a passive secondary optical compensator element between collected light and a receiver. In certain embodiments, the compensator element accomplishes refraction followed by at least one total internal reflection of the collected light. Another technique employs a receiver having radially-oriented strings of cells connected in series, where strings in opposing sectors are connected in parallel and in series with each other to reduce a dependence of power and/or current output, on alignment of the collector apparatus relative to a light source.

Abstract: Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light.

Abstract: Systems and methods are provided for imaging a planar specular object such as a semiconductor wafer. In one embodiment, an imaging system for imaging a defect on a planar specular object includes a telecentric lens having a sufficiently aspherical surface such that the telecentric lens is substantially corrected for an optical aberration. The imaging system also includes a telecentric stop including an aperture therein to block light reflected from the planar specular object while allowing light reflected from the defect to pass through the aperture. The imaging system further includes a lens group having a system stop positioned between the telecentric stop and the lens group. The lens group is substantially corrected for the optical aberration independent of the telecentric lens.

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract: A method of removing an artifact resulting from an in-line illumination device of an imaging system from an object image. It includes obtaining a first image of the artifact using a first artifact illumination level and imaging the object using the imaging system wherein the illumination device is using an object illumination level. An artifact image is independent of the object and has pixel values related to the illumination level. Thus, the artifact can be removed by subtracting respective pixel values of an artifact image from respective values of the object image on a pixel address-by-pixel address basis. Various illumination levels can be used to create more than one artifact image. The artifact image for the subtraction can be one of the images taken or can be a scaled image where an artifact image is scaled to the object illumination level.

Abstract: A small feature at a target location on a working surface of a workpiece is laser machined. A laser beam propagating along a beam path is directed for incidence at the target location on the working surface to machine the small feature. A focusing lens sized to converge the laser beam on the working surface is set in the beam path at a short working distance from the working surface to laser machine the small feature and thereby eject target material from the workpiece back toward the focusing lens. A sacrificial protective member positioned between the focusing lens and the working surface transmits without appreciable distortion or adsorption the laser beam focused by the focusing lens and incident on the working surface. The sacrificial protective member intercepts the ejected target material to prevent a sufficient amount of it from reaching and thereby appreciably contaminating the focusing lens.

Abstract: An improved method and apparatus for detecting problems with fit and finish of manufactured articles is presented which uses structured light. Two or more structured light images acquired from opposing directions is used to measure the fit of mating surfaces while avoiding false positives caused by small defects near the seam.

Abstract: Systems and methods are provided for imaging a planar specular object such as a semiconductor wafer. In one embodiment, an imaging system for imaging a defect on a planar specular object includes a telecentric lens having a sufficiently aspherical surface such that the telecentric lens is substantially corrected for an optical aberration. The imaging system also includes a telecentric stop including an aperture therein to block light reflected from the planar specular object while allowing light reflected from the defect to pass through the aperture. The imaging system further includes a lens group having a system stop positioned between the telecentric stop and the lens group. The lens group is substantially corrected for the optical aberration independent of the telecentric lens.

Abstract: Systems and methods are provided for imaging a planar specular object such as a semiconductor wafer. In one embodiment, an imaging system for imaging a defect on a planar specular object includes a telecentric lens having a sufficiently aspherical surface such that the telecentric lens is substantially corrected for an optical aberration. The imaging system also includes a telecentric stop including an aperture therein to block light reflected from the planar specular object while allowing light reflected from the defect to pass through the aperture. The imaging system further includes a lens group having a system stop positioned between the telecentric stop and the lens group. The lens group is substantially corrected for the optical aberration independent of the telecentric lens.

Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

Abstract: A method and apparatus for achieving monochromatic response from a low-cost color imager is presented. In this method and apparatus, the out-of-band response to infrared (IR) light is by solid state sensors exploited to produce a monochrome image. The monochrome image is produced by removing the IR blocking filter from the sensor and illuminating the scene to be imaged with IR radiation from an LED. The wavelength emitted from the LED is matched to the wavelength or wavelengths that correspond to a region where the sensor's response to IR light is relatively even, despite the color-mosaic filter permanently attached to the sensor.

Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

Abstract: A vario-astigmatic beam expander is capable of collimating an astigmatic light beam, or inducing astigmatism in a well-collimated beam, by passing the light beam through a combination of spherical and cylindrical lenses, whereby both the degree of astigmatism and the axis of astigmatism induced are continuously adjustable. The beam expander has applications in industrial laser processing systems.