Patents by Inventor Leo C. Clarke

Leo C. Clarke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Features in substrates and methods of forming
    Patent number: 7833426
    Abstract: The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: November 16, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Leo C. Clarke, Chris Aschoff, Cary G. Addington
  • PRINTED ARTICLE
    Publication number: 20080248261
    Abstract: An article having a printed image is formed from a substrate, an adhesive disposed over the substrate, a sheet disposed over the adhesive, a digitally printed image directly printed on the sheet, and an elastomer disposed over the printed image.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 9, 2008
    Inventors: Robert A. Bonnett, Betty A. Coulman, Barbara Baxter, Leo C. Clarke, Susan Williams
  • Printing apparatus and method
    Patent number: 7377617
    Abstract: A printer comprises an arm mounted on a pivot member. The arm has a first portion adapted to move along an arcuate path. A drive motor rotates the arm about the pivot member. An electromagnetic radiation emitter mounted on the first portion is adapted to emit pulses onto an electromagnetic radiation-sensitive medium.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: May 27, 2008
    Inventors: Leo C. Clarke, Douglas C. Snell, Makarand P. Gore
  • Protected electrical interconnect assemblies
    Patent number: 6905342
    Abstract: The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: June 14, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wayne K. Swier, Leo C. Clarke
  • Printhead positioning mechanism
    Patent number: 6896355
    Abstract: A printhead positioning mechanism has an arm mounted on a pivot member and having a first portion adapted to move along an arcuate path. A printhead is mounted on an arm.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: May 24, 2005
    Assignee: Hewlett-Packard Development Company, LP.
    Inventors: Leo C. Clarke, Douglas C. Snell
  • Printhead positioning mechanism
    Publication number: 20040239720
    Abstract: A printhead positioning mechanism has an arm mounted on a pivot member and having a first portion adapted to move along an arcuate path A printhead is mounted on an arm.
    Type: Application
    Filed: June 2, 2003
    Publication date: December 2, 2004
    Inventors: Leo C. Clarke, Douglas C. Snell
  • Electrical interconnect assemblies and methods of forming same
    Publication number: 20040198074
    Abstract: The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.
    Type: Application
    Filed: April 1, 2003
    Publication date: October 7, 2004
    Inventors: Wayne K. Swier, Leo C. Clarke