Abstract: Pressure sensors and their methods of use are described. In one embodiment, a pressure sensor includes a probe body and a capacitive sensor disposed at a distal end of the probe body. The capacitive sensor produces a sensing capacitance. The pressure sensor also includes a shunt capacitance. In the described pressure sensor, a change in the sensing capacitance due to dimensional changes associated with a temperature change is offset by a corresponding change in the shunt capacitance.

Abstract: Pressure sensors and their methods of use are described. In one embodiment, a pressure sensor may include: a tubular probe body; a capacitive sensor disposed at the distal end of the probe body; a lead electrically coupled to the sensor extending along an interior space of the probe body; and at least one support formed of a material having a relatively low dielectric constant disposed within the probe body to support the lead and space the lead away from an inner wall of the probe body. This may help to minimize shunt capacitance and changes in shunt capacitance due to radial movement of the lead. In other embodiments, a pressure sensor may include a channel formed in a wall of the probe body, a temperature sensor disposed at a distal end of the probe body, and a temperature sensor lead disposed in the channel and connected to the temperature sensor.

Abstract: Pressure sensors and their methods of use are described. In one embodiment, a pressure sensor includes a pressure deflectable diaphragm end formed of a first material with a first coefficient of thermal expansion, and a relatively non-deformable component formed of a second material having a second coefficient of thermal expansion. The pressure deflectable diaphragm end and the non-deformable component form a first and a second portion of a capacitor. An intermediate component separates, or is disposed between, the pressure deflectable diaphragm end and the relatively non-deformable component. The intermediate component is formed of a material with a coefficient of thermal expansion that is less than the first coefficient of thermal expansion which may help minimize changes in span with temperature. In other embodiments, a pressure sensor includes an intermediate circuit located between a distal end of the pressure sensor and a remotely located circuit enclosure including a main circuit.

Abstract: High temperature pressure sensing devices and methods are disclosed. In some embodiments, a high temperature pressure sensor including intrinsic zero output and span correction versus temperature is disclosed. In addition, ways in which to improve high temperature performance through the use of intermediate circuits located towards the distal end of the high temperature pressure sensor as well as configurations to reduce thermally induced stresses within the pressure sensor are disclosed. The disclosed embodiments also detail ways in which to reduce signal loss due to various stray capacitances within the pressure sensor to improve signal fidelity and sensitivity.

Abstract: High temperature pressure sensing devices and methods are disclosed. In some embodiments, a high temperature pressure sensor including intrinsic zero output and span correction versus temperature is disclosed. In addition, ways in which to improve high temperature performance through the use of intermediate circuits located towards the distal end of the high temperature pressure sensor as well as configurations to reduce thermally induced stresses within the pressure sensor are disclosed. The disclosed embodiments also detail ways in which to reduce signal loss due to various stray capacitances within the pressure sensor to improve signal fidelity and sensitivity.

Abstract: High temperature pressure sensing devices and methods are disclosed. In some embodiments, a high temperature pressure sensor including intrinsic zero output and span correction versus temperature is disclosed. In addition, ways in which to improve high temperature performance through the use of intermediate circuits located towards the distal end of the high temperature pressure sensor as well as configurations to reduce thermally induced stresses within the pressure sensor are disclosed. The disclosed embodiments also detail ways in which to reduce signal loss due to various stray capacitances within the pressure sensor to improve signal fidelity and sensitivity.