Abstract: A re-configurable optical waveguide includes an electro-optic substrate and plurality of electrodes above substrate. Electrodes are forming photonic crystal waveguide with photonic crystal periodic structure which has a slab optical waveguide on the top surface of a substrate and also has refractive index variation areas due to electro-optical effect with a different refractive index from that of the core layer of the slab optical waveguide arranged in a lattice array shape at part of the slab optical waveguide. In this case, the refractive index variation areas are formed of the same material as the material constituting the core layer of the slab optical waveguide. The refractive index variation areas are arranged in the lattice array shape on both the sides of an optical waveguide area, where light is propagated. The refractive index of the core layers of the refractive index variation areas is larger than that of the core layer of an area of the refractive index variation area.

Abstract: A low temperature sealing glass composition suitable for sealing integrated circuit alumina packages at temperatures below 400.degree. C. in a short time of about ten minutes. This sealing glass composition is a mixture of a glass powder and 1 to 50% (by weight) of one or more low expansion ceramic powders. The glass powder comprises a lead borate or lead zinc borate glass and the joint addition of Cu.sub.2 O, Tl.sub.2 O and F in a range of 6.3 to 20% (by weight) wherein the molar ratio of Cu to Tl to F is in the range between 0.8 Cu: 0.8 Tl: 0.8 F to 1.2 Cu: 1.2 Tl: 1.2 F. The glass in powder form is blended with one or more compatible low expansion ceramic powders including cordierite, zircon, willemite, lead titanate or modified tin oxide.

Abstract: Low temperature sealing glass compositions comprising 35 to 80% by weight TeO.sub.2, 15 to 50% V.sub.2 O.sub.5 and 0.1 to 20% Nb.sub.2 O.sub.5, ZrO.sub.2 and/or ZnO.

Abstract: Fluid, stable glasses useful for low-temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, phosphorus pentoxide, titania and/or zirconium oxide to the lead oxide vanadium oxide binary. The phosphorus pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum oxide.Sealing glass compositions comprising these low-melting lead-vanadia glasses in powder form and refractory fillers of lower thermal expansion for use in hermetically sealing semiconductor devices in ceramic packages are disclosed. Group V metal oxides, particularly niobium-containing oxides, are preferred fillers. Silver metal is a preferred filler for making die-attach compositions.

Abstract: Extremely low-melting oxide glasses useful in silver/glass die-attach materials are disclosed. These glasses are composed of silver oxide, phosphorus oxide and a third component comprising PbO, CdO, ZnO or combination thereof. Their melting point lies in the 200.degree.-300.degree. C. range.

Abstract: Fluid, stable glasses that are useful for low temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, and phosphorus pentoxide to the lead oxide-vanadium oxide binary. The phosphorous pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum pentoxide. Additives and fillers may be incorporated into the glass composition to enhance the fluidity or adhesive characteristics of the glass, alter its coefficient of linear thermal expansion or make it suitable for die attach application. Group V metal oxides, particularly niobium pentoxide, are preferred fillers for altering the coefficient of linear thermal expansion. Similarly these Group V metal oxides may also be added as particulate fillers to lead borate, lead borosilicate and zinc borate glasses. Silver metal is a preferred filler for making die attach compositions.