Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

Abstract: The disclosed technology is a pressure transducer with a bleed valve built into the body of the transducer for purging liquid systems. The transducer assembly includes a body, a bleed valve port defined in the body and configured to accept a bleed valve, an interface port attached to the body, an adapter attached to a portion of the interface port, a header attached to the adapter and the body, a pressure transducer mounted to the header, and an internal cavity in communication with the interface port, the pressure transducer, and the bleed valve port. The bleed valve port is configured to vent a gas from the internal cavity. A bleed valve disposed in the bleed valve port is configured to controllably vent a gas from the internal cavity.

Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

Abstract: This disclosure provides example systems and methods for high pressure flat plate transducer assemblies. A first example embodiment of the transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can be configured for accepting the transducer and for mating with the housing at an interface between the header back side and the housing. The first embodiment of the transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing. A second example embodiment is provided that includes a one-piece housing having a built-in header portion configured for accepting the transducer. In this second embodiment, the interface adapter is configured for attaching to a mating surface and to the housing. In the second example embodiment, the transducer assembly is configured such that the pressure presses the transducer against the housing.

Abstract: This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.

Abstract: This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.

Abstract: This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.

Abstract: This disclosure provides example systems and methods for a high pressure flat plate transducer assembly. A transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can include a header front side configured for accepting the transducer and a header back side configured for mating with the housing at an interface between the header back side and the housing. The transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing.

Abstract: This disclosure provides example systems and methods for high pressure flat plate transducer assemblies. A first example embodiment of the transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can be configured for accepting the transducer and for mating with the housing at an interface between the header back side and the housing. The first embodiment of the transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing. A second example embodiment is provided that includes a one-piece housing having a built-in header portion configured for accepting the transducer. In this second embodiment, the interface adapter is configured for attaching to a mating surface and to the housing. In the second example embodiment, the transducer assembly is configured such that the pressure presses the transducer against the housing.

Abstract: This disclosure provides example systems and methods for a high pressure flat plate transducer assembly. A transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can include a header front side configured for accepting the transducer and a header back side configured for mating with the housing at an interface between the header back side and the housing. The transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing.

Abstract: This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.

Abstract: An enclosed, flat covered leadless pressure sensor assembly suitable for extreme environment operation including dynamic, ultra-high temperature heating, light and heat flash, and high-speed, flow-related environments. The pressure sensor assembly comprises a substrate comprising a micromachined sensing diaphragm defined on a first side. A cover is attached to the first side of the substrate such that it covers at least the sensing diaphragm. The top surface of the cover is substantially flat, thereby promoting uniformity in the distribution of stress and thermal effects across a top surface of the cover.

Abstract: An enclosed, flat covered leadless pressure sensor assembly suitable for extreme environment operation including dynamic, ultra-high temperature heating, light and heat flash, and high-speed, flow-related environments. The pressure sensor assembly comprises a substrate comprising a micromachined sensing diaphragm defined on a first side. A cover is attached to the first side of the substrate such that it covers at least the sensing diaphragm. The top surface of the cover is substantially flat, thereby promoting uniformity in the distribution of stress and thermal effects across a top surface of the cover.

Abstract: A pressure transducer, particularly adapted to measure the pressure in a tire and to enable the tire to be filled includes a first housing, having an internal hollow. Positioned in the hollow of the first housing is a second housing, also having an internal hollow. The second housing is supported within the first housing so that a passageway for airflow exists between the housings. The second housing has a pressure port for monitoring the pressure of a tire. The first housing has an inlet port for receiving a source of pressure. The inlet port contains a valve which is selectively operated. The valve, when operated, permits air to flow into the hollow of the first housing and to flow about the periphery of the second housing to enter the pressure port associated with the second housing. The pressure port may, as indicated, be associated with a tire and the second housing contains a pressure sensing device which monitors the pressure in the tire via the pressure port.

Abstract: A pressure transducer, particularly adapted to measure the pressure in a tire and to enable the tire to be filled includes a first housing, having an internal hollow. Positioned in the hollow of the first housing is a second housing, also having an internal hollow. The second housing is supported within the first housing so that a passageway for airflow exists between the housings. The second housing has a pressure port for monitoring the pressure of a tire. The first housing has an inlet port for receiving a source of pressure. The inlet port contains a valve which is selectively operated. The valve, when operated, permits air to flow into the hollow of the first housing and to flow about the periphery of the second housing to enter the pressure port associated with the second housing. The pressure port may, as indicated, be associated with a tire and the second housing contains a pressure sensing device which monitors the pressure in the tire via the pressure port.

Abstract: A pressure transducer employing a metal isolation diaphragm. A volume of oil is located between the metal diaphragm and a silicon sensor received in a base member. In order to reduce errors at very low pressure caused by the oil exerting a tension on the deflecting portion of said silicon sensor, the metal diaphragm has an extending dome or dimple above the location of the silicon sensor. The silicon sensor is also recessed below the supporting base plate so that the separation between the silicon sensor and the metal diaphragm increases. The base plate also contains a series of shallow, narrow concentric grooves which further reduces surface tension between the metal diaphragm and the base plate.