Patents by Inventor Leo H. Chiang

Leo H. Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing layer analyzer and method
    Patent number: 10272541
    Abstract: A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: April 30, 2019
    Assignees: Rohm and Haas Electronic Matericals CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Scott Chang, Jeff Tsai, Francis V. Acholla, Andrew Wank, Mark Gazze, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Method of manufacturing chemical mechanical polishing pads
    Patent number: 9770808
    Abstract: A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: September 26, 2017
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Chemical mechanical polishing pad, polishing layer analyzer and method
    Patent number: 9737971
    Abstract: A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: August 22, 2017
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • POLISHING LAYER ANALYZER AND METHOD
    Publication number: 20170209979
    Abstract: A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Application
    Filed: January 22, 2016
    Publication date: July 27, 2017
    Inventors: Scott Chang, Jeff Tsai, Francis V. Acholla, Andrew Wank, Mark Gazze, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • CHEMICAL MECHANICAL POLISHING PAD, POLISHING LAYER ANALYZER AND METHOD
    Publication number: 20170197290
    Abstract: A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Application
    Filed: January 12, 2016
    Publication date: July 13, 2017
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING PADS
    Publication number: 20170197295
    Abstract: A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.
    Type: Application
    Filed: January 12, 2016
    Publication date: July 13, 2017
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin