Abstract: A vacuum attachment for a floor buffer having a base atop of which is mounted a motor and below which a buffing pad is positioned for engagement with a floor and for rotation by the motor. The vacuum attachment includes a suction ring configured for positioning around the buffing pad. The suction ring is hollow and is provided with a number of inlets through which liquid and dry waste thrown off by the buffing pad can be drawn. A backpack, adapted for wear by a user, is positioned remote from the suction ring. A wet/dry vacuum is positioned in the backpack. A hose connects the suction ring to the vacuum such that, when the vacuum is energized, liquid and dry waste thrown off by the buffing pad are drawn through the inlets in the suction ring and through the hose into the vacuum for collection and subsequent disposal.