Abstract: A connector insert arrangement, an active optical cable and methods are described. The connector insert is receivable in a connector housing for removable engagement with a complementary connector. Dielectric inserts each support one or more electrical contacts for access by the complementary connector and each electrical contact is selected as one of a contact pad and a spring probe pin for electrical contact with a complementary spring probe pin and complementary contact pad, respectively, in the complementary connector. A ground body supports the dielectric inserts to maintain a characteristic transmission line impedance along each of a plurality of high speed data paths such that each high speed data path serves as an independent transmission line structure that provides a data transfer rate of at least 1 gigabit per second. An active optical cable is described that can be hermaphroditic.

Abstract: A connector insert arrangement, an active optical cable and methods are described. The connector insert is receivable in a connector housing for removable engagement with a complementary connector. Dielectric inserts each support one or more electrical contacts for access by the complementary connector and each electrical contact is selected as one of a contact pad and a spring probe pin for electrical contact with a complementary spring probe pin and complementary contact pad, respectively, in the complementary connector. A ground body supports the dielectric inserts to maintain a characteristic transmission line impedance along each of a plurality of high speed data paths such that each high speed data path serves as an independent transmission line structure that provides a data transfer rate of at least 1 gigabit per second. An active optical cable is described that can be hermaphroditic.

Abstract: The present invention discloses an adaptor suitable for use in optoelectronic circuit board. The adaptor according the present invention serves to adapt a package pin-out arrangement to a desired pin-out arrangement on a printed circuit board. The adaptor comprises a pin-in arrangement that electrically couples with the package pin-out arrangement. The adaptor further comprises an adaptor pin-out arrangement that is geometrically identical to the desired pin-out, and a flex-circuit that provides a plurality of electrical paths to connect the pin-in arrangement with the adaptor pin-out arrangement. In various embodiments, the adaptor further comprises a clamshell for holding the adaptor pin-out and the flex-circuit together in a single flat format.

Abstract: An optical architecture and network is described that includes first and second transceivers coupled by an optical fiber. The first and second transceivers concurrently transmit and receive a plurality of optical signals that propagate in a first direction and at least one optical signal propagating in a second, opposite direction through the optical fiber. The network includes the first transceiver that uses a first means for combining the plurality of optical signals and a second means for transmitting the combined plurality of optical signals into the fiber in the first direction and for intercepting and redirecting the optical signal propagating from the fiber in the second, opposite direction. The network further includes the second transceiver that uses a third means for passing the optical signal propagating into the fiber in the second opposite direction and for redirecting the optical signals propagating from the fiber in the first direction.

Abstract: An opto-electric module adapted to be coupled with an optical fiber on a first side and a plurality of electrical conductors on a second side. The opto-electric module includes a header with a plurality of pins extending through the header a thermo-electric cooler with a hot plate of the thermo-electric cooler disposed against a second, opposing side of the header and a plurality of active and passive optical components adapted to convert between an optical signal format within the optical fiber and an electrical signal format within at least one conductor of the plurality of conductors, said plurality of active and passive optical components all being in thermal contact with a cold plate of the thermo-electric cooler.

Abstract: An optical fiber bonding scheme provides improved bonding properties and improved lifetime for non-hermetic fiber optic packages such as OSAs. The bonding scheme includes an optical fiber bonded to a substrate surface with an epoxy and a diffusion retarding plate covering the epoxy. The diffusion retarding plate prevents moisture absorption by the top surface of the epoxy and the large footprint of the epoxy provides a long diffusion path which produces a lower water concentration gradient within the epoxy, restricts lateral diffusion of absorbed water molecules within the epoxy, and produces an extremely saturation resistant epoxy. The diffusion retarding plate may further include legs that bound opposed sides of the epoxy providing further saturation resistance.

Abstract: An opto-electric module in TO form factor adapted to be coupled with an optical fiber on a first side and a plurality of electrical conductors on a second side. The opto-electric module includes a header with a plurality of pins extending through the header, each pin of the plurality of pins extending through the header and each pin of the plurality of pins being adapted to engage a respective conductor of the plurality of conductors on a first side of the header, a thermo-electric cooler with a hot plate of the thermo-electric cooler disposed against a second, opposing side of the header and a plurality of active and passive optical components adapted to convert between an optical signal format within the optical fiber and an electrical signal format within at least one conductor of the plurality of conductors, said plurality of active and passive optical components all being in thermal contact with a cold plate of the thermo-electric cooler.

Abstract: An optical thick film formed on a photodetector improves the optical coupling efficiency between the optical fiber and photodetector which are optically coupled. The optical thick film has a refractive index that is between the refractive index of air and the refractive index of photodetector upon which the optical matching coating is disposed. Silicone may advantageously be formed as the optical thick film coating on the photodetector.

Abstract: An optical fiber bonding scheme provides improved bonding properties and improved lifetime for non-hermetic fiber optic packages such as OSAs. The bonding scheme includes an optical fiber bonded to a substrate surface with an epoxy and a diffusion retarding plate covering the epoxy. The diffusion retarding plate prevents moisture absorption by the top surface of the epoxy and the large footprint of the epoxy provides a long diffusion path which produces a lower water concentration gradient within the epoxy, restricts lateral diffusion of absorbed water molecules within the epoxy, and produces an extremely saturation resistant epoxy. The diffusion retarding plate may further include legs that bound opposed sides of the epoxy providing further saturation resistance.

Abstract: An optical thick film formed on a photodetector improves the optical coupling efficiency between the optical fiber and photodetector which are optically coupled. The optical thick film has a refractive index that is between the refractive index of air and the refractive index of photodetector upon which the optical matching coating is disposed. Silicone may advantageously be formed as the optical thick film coating on the photodetector.